TLV713P-Q1
- AEC-Q100 Qualified with the Following Results:
- Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
- Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C4B
- Input Voltage Range: 1.4 V to 5.5 V
- Stable Operation With or Without Capacitors
- Foldback Overcurrent Protection
- Package: 5-Pin SOT-23
- Very Low Dropout: 230 mV at 150 mA
- Accuracy: 1%
- Low IQ: 50 µA
- Available in Fixed-Output Voltages:
- 1 V to 3.3 V
- High PSRR: 65 dB at 1 kHz
- Active Output Discharge
The TLV713P-Q1 series of low-dropout (LDO) linear regulators are low quiescent current LDOs with excellent line and load transient performance and are designed for power-sensitive applications. These devices provide a typical accuracy of 1%.
The TLV713P-Q1 series of devices is designed to be stable without an output capacitor. The removal of the output capacitor allows for a very small solution size. However, the TLV713P-Q1 series is also stable with any output capacitor if an output capacitor is used.
The TLV713P-Q1 also provides inrush current control during device power-up and enabling. The TLV713P-Q1 limits the input current to the defined current limit to avoid large currents from flowing from the input power source. This functionality is especially important in battery-operated devices.
The TLV713P-Q1 series is available in a standard DBV package and provides an active pulldown circuit to quickly discharge output loads. The TLV713P-Q1 is suited for automotive applications because the device is qualified for AEC-Q100 grade 1.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV713P-Q1 Capacitor-Free, 150-mA, Low-Dropout Regulator With Foldback Current Limit for Portable Devices datasheet | PDF | HTML | 2015年 5月 29日 |
EVM User's guide | TLV713xxEVM-171 Evaluation Module User's Guide | 2012年 8月 17日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。