TMUXHS221
- Compatible to USB 2.0 and eUSB2 LS, FS, and HS physical layers
- Analog switch that can support most CMOS or differential signals up to 3.3 V and 3 Gbps
- Data pins are 5 V tolerant
- Low RON of 3 Ω at VI/O = 0.2 V
- High –3 dB BW of 3.3 GHz
- Excellent for USB 2.0 or eUSB2 HS signals at 240 MHz:
- Insertion loss = –0.4 dB
- Return loss = –22 dB
- Off isolation / cross talk = –32 dB
- Minimal vertical and horizontal USB 2.0 HS eye attenuation
- 3.3 V supply voltage
- 1.8 or 3.3 V control logic inputs
- Extended industrial temperature range of –40 to 125°C
- Small 10-pin 1.4 mm × 1.8 mm, UQFN package
- Pin-to-pin and BoM-to-BoM with multiple sources
The TMUXHS221 is a high-speed bidirectional 2:1/1:2 multiplexer/demultiplexer optimized for USB 2.0 and eUSB2 LS, FS, and HS signaling. The TMUXHS221 is an analog passive switch that works for many high-speed interfaces for data rates up to 3 Gbps. The TMUXHS221 supports either differential or single ended CMOS signaling with a voltage range of −0.3 to 3.6 V.
The excellent high speed performance of the TMUXHS221 results in minimal attenuation to the USB 2.0 or eUSB2 HS signal eye diagrams with very low channel ON resistance, high bandwidth, low reflection, and low added jitter. The device is optimized for excellent high frequency response so that passing USB 2.0 HS electrical compliance becomes easier. The datapaths of the device are also matched for best intra-pair skew performance.
The TMUXHS221 has an extended temperature range that suits many rugged applications including industrial and high reliability use cases.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TMUXHS221 USB 2.0 480 Mbps 2:1/1:2 Multiplexer/Demultiplexer Switch datasheet (Rev. A) | PDF | HTML | 2022年 11月 16日 |
Product overview | Industry's First High-Speed Mux With 1.2 V I/O Control Logic: TMUXHS221LV (Rev. A) | PDF | HTML | 2023年 9月 6日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
TMUXHS221EVM — TMUXHS221 2 通道差動 2:1/1:2 高速多工器/解多工器開關評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
UQFN (NKG) | 10 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。