TPA1517
- TDA1517P Compatible
- High Power Outputs (6 W/Channel)
- Surface Mount Availability 20-Pin Thermal SOIC PowerPAD™
- Thermal Protection
- Fixed Gain: 20 dB
- Mute and Standby Operation
- Supply Range: 9.5 V - 18 V
PowerPAD is a trademark of Texas Instruments
The TPA1517 is a stereo audio power amplifier that contains two identical amplifiers capable of delivering 6 W per channel of continuous average power into a 4-
load at 10% THD+N or 5 W per channel at 1% THD+N. The gain of each channel is fixed at 20 dB. The amplifier features a mute/standby function for power-sensitive applications. The amplifier is available in the PowerPAD™ 20-pin surface-mount thermally-enhanced package (DWP) that reduces board space and facilitates automated assembly while maintaining exceptional thermal characteristics. It is also available in the 20-pin thermally enhanced DIP package (NE).
技術文件
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檢視所有 10 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | 6-W Stereo Audio Power Amplifier datasheet (Rev. D) | 2007年 2月 20日 | |
| Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||
| Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||
| Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018年 7月 6日 | ||
| Application note | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | 2013年 5月 1日 | ||
| Application note | Measuring Class-D Amplifiers for Audio Speaker Overstress Testing | 2005年 10月 28日 | ||
| Application note | Pop Reduction for the TPA1517 Audio Power Amplifier | 2004年 8月 31日 | ||
| Application note | RC Filter Box For Class-D Output Power and THD+N Measurement | 2004年 2月 20日 | ||
| EVM User's guide | TPA1517DWPEVM - User Guide | 1999年 1月 6日 | ||
| EVM User's guide | TPA1517NEEVM - User Guide | 1999年 1月 6日 |
設計與開發
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模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HSOIC (DWP) | 20 | Ultra Librarian |
| PDIP (NE) | 20 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。