TPS2071
- Complete USB Hub Power Solution
- Meets USB Specifications 1.1 and 2.0
- Independent Thermal and Short-Circuit Protection
- 3.3-V Regulator for USB Hub Controller
- Overcurrent Logic Outputs
- 4.5-V to 5.5-V Operating Range
- CMOS- and TTL-Compatible Enable Inputs
- 185 µA Bus-Power Supply Current
- Available in 32-Pin HTSSOP PowerPAD™ Package
- -40°C to 85°C Ambient Temperature Range
2PowerPAD is a trademark of Texas Instruments.
The TPS2070 and TPS2071 provide a complete USB hub power solution by incorporating four major functions: current-limited power switches for four ports, a 3.3-V 100-mA regulator, a 5-V regulator controller for self-power, and a DP0 line control to signal attach/detach of the hub.
These devices are designed to meet bus-powered and self-powered hub requirements. These devices are also designed for hybrid hub implementations and allow for automatic switching from self-powered mode to bus-powered mode if loss of self-power is experienced (can be disabled by applying a logic high to BP_DIS).
Each port has a current-limited 107-m
N-channel MOSFET high-side power switch for 100-mA bus-powered operation. All the N-channel MOSFETs are designed without parasitic diodes, preventing current backflow into the inputs.
For applications not requiring a 5-V regulator controller, use the TPS2074 or TPS2075 device.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | Four-Port USB Hub Power Controllers datasheet (Rev. B) | 2007年 10月 11日 | |
| EVM User's guide | TPS2071 Hybrid USB Hub Evaluation Module User's Guide | 2000年 8月 3日 |
設計與開發
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TPS2071EVM-159 — TPS207x 評估模組
- Bus-powered input voltage range (BP), 0 to 100 mA/port, 4.75 V min to 5.25 V max
- Self-power input voltage range (SP), 0 to 500 mA/port, 4.85 V min to 5.15 V max
- Downstream output voltage range in bus-powered mode, 0 to 100 mA/port, 4.4 V min to 5.25 V max
- Downstream output voltage range in (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HTSSOP (DAP) | 32 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點