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TPS22901

現行

3.6-V、0.5-A、78-mΩ、22-nA 洩漏負載開關

產品詳細資料

Number of channels 1 Vin (min) (V) 1 Vin (max) (V) 3.6 Imax (A) 0.5 Ron (typ) (mΩ) 83 Shutdown current (ISD) (typ) (µA) 0.137 Quiescent current (Iq) (typ) (µA) 0.204 Soft start Fixed Rise Time Current limit type None Features Inrush current control, Quick output discharge Rating Catalog Operating temperature range (°C) -40 to 85 FET Internal Device type Load switches Function Inrush current control
Number of channels 1 Vin (min) (V) 1 Vin (max) (V) 3.6 Imax (A) 0.5 Ron (typ) (mΩ) 83 Shutdown current (ISD) (typ) (µA) 0.137 Quiescent current (Iq) (typ) (µA) 0.204 Soft start Fixed Rise Time Current limit type None Features Inrush current control, Quick output discharge Rating Catalog Operating temperature range (°C) -40 to 85 FET Internal Device type Load switches Function Inrush current control
DSBGA (YFP) 4 1 mm² 1 x 1
  • Integrated P-Channel Load Switch
  • Low Input Voltage: 1 V to 3.6 V
  • ON-Resistance (Typical Values)
    • rON = 78 mΩ at VIN = 3.6 V
    • rON = 93 mΩ at VIN = 2.5 V
    • rON = 109 mΩ at VIN = 1.8 V
    • rON = 146 mΩ at VIN = 1.2 V
  • 500 mA Maximum Continuous Switch Current
  • Quiescent Current: 82 nA at 1.8 V
  • Shutdown Current: 44 nA at 1.8 V
  • Low Control Input Thresholds Enable Use of 1.2-V, 1.8-V, 2.5-V, and 3.3-V Logic
  • Controlled Slew Rate to Avoid Inrush Currents
    • tr = 40 µs at VIN = 1.8 V (TPS22901/2)
    • tr = 220 µs at VIN = 1.8 V (TPS22902B)
  • Quick Output Discharge (TPS22902/2B)
  • ESD Performance Tested Per JESD 22
    • 2000-V Human Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Four-Pin Wafer-Chip-Scale DSBGA Package
    • 0.8-mm × 0.8-mm, 0.4-mm Pitch, 0.5-mm Height (YFP)
  • Integrated P-Channel Load Switch
  • Low Input Voltage: 1 V to 3.6 V
  • ON-Resistance (Typical Values)
    • rON = 78 mΩ at VIN = 3.6 V
    • rON = 93 mΩ at VIN = 2.5 V
    • rON = 109 mΩ at VIN = 1.8 V
    • rON = 146 mΩ at VIN = 1.2 V
  • 500 mA Maximum Continuous Switch Current
  • Quiescent Current: 82 nA at 1.8 V
  • Shutdown Current: 44 nA at 1.8 V
  • Low Control Input Thresholds Enable Use of 1.2-V, 1.8-V, 2.5-V, and 3.3-V Logic
  • Controlled Slew Rate to Avoid Inrush Currents
    • tr = 40 µs at VIN = 1.8 V (TPS22901/2)
    • tr = 220 µs at VIN = 1.8 V (TPS22902B)
  • Quick Output Discharge (TPS22902/2B)
  • ESD Performance Tested Per JESD 22
    • 2000-V Human Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Four-Pin Wafer-Chip-Scale DSBGA Package
    • 0.8-mm × 0.8-mm, 0.4-mm Pitch, 0.5-mm Height (YFP)

The TPS22901, TPS22902, and TPS22902B are small, low ON-resistance (rON) load switches with a controlled turnon. These devices contain a P-channel MOSFET that operates over an input voltage range of 1.0 V to 3.6 V. The switch is controlled by an on/off input (ON), which can interface directly with low-voltage control signals. In the TPS22902 and TPS22902B, an 88-Ω on-chip load resistor is added for output quick discharge when the switch is turned off.

The TPS22901, TPS22902, and TPS22902B are available in a space-saving 4-pin DSBGA (YFP) with 0.4-mm pitch. These devices are characterized for operation over the free-air temperature range of –40°C to 85°C.

The TPS22901, TPS22902, and TPS22902B are small, low ON-resistance (rON) load switches with a controlled turnon. These devices contain a P-channel MOSFET that operates over an input voltage range of 1.0 V to 3.6 V. The switch is controlled by an on/off input (ON), which can interface directly with low-voltage control signals. In the TPS22902 and TPS22902B, an 88-Ω on-chip load resistor is added for output quick discharge when the switch is turned off.

The TPS22901, TPS22902, and TPS22902B are available in a space-saving 4-pin DSBGA (YFP) with 0.4-mm pitch. These devices are characterized for operation over the free-air temperature range of –40°C to 85°C.

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技術文件

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類型 標題 日期
* Data sheet TPS2290x Ultra-Small, Low Input Voltage, Low rON, Load Switch datasheet (Rev. E) 2020年 9月 24日
Application note Load Switch Thermal Considerations (Rev. A) 2018年 10月 11日
Application note Basics of Load Switches (Rev. A) 2018年 9月 5日
Selection guide Power Management Guide 2018 (Rev. R) 2018年 6月 25日
Application note Selecting a Load Switch to Replace a Discrete Solution 2017年 4月 30日
Application note Timing of Load Switches 2017年 4月 27日
Application note Managing Inrush Current (Rev. A) 2015年 5月 28日
User guide TPS22901/02/02B Evaluation Module (Rev. A) 2009年 3月 27日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

模擬型號

TPS22901 Unencrypted PSpice Transient Model Package (Rev. A)

SLVM834A.ZIP (37 KB) - PSpice Model
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
參考設計

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The PMP10630 reference design is a complete high density power solution for Xilinx® Kintex® UltraScale™ XCKU040 FPGA. This design uses an optimal combination of SIMPLE SWITCHER® modules and LDOs to provide all the necessary voltage rails in a small solution size of 36 x 43 mm (1.4 (...)
Test report: PDF
電路圖: PDF
參考設計

TIDM-RF-SENSORNODE — 適用於 6LoWPAN 和 2.4 GHz 應用的射頻感測器節點開發平台

The RF Sensor Node Platform is intended as a miniature development platform for 6LoWPAN and 2.4 GHz applications. The platform has three on-board sensors which includes a 3-axis accelerometer, a temperature sensor and two light sensors. The RF Sensor Node Platform can be a stand-alone sensor node (...)
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
DSBGA (YFP) 4 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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