TPS657120
- 3 Step-Down Converters:
- VIN Range From 2.8 V to 5.5 V
- Power Save Mode at Light Load Current
- Output Voltage Accuracy in PWM Mode ±2%
- Typical 16-µA Quiescent Current per DCDC1
and DCDC2 Converter - Typical 26-µA Quiescent Current for DCDC3
Converter - Dynamic Voltage Scaling
- 100% Duty Cycle for Lowest Dropout
- 2 LDOs:
- 2 × 10-mA Output Current
- Low Noise RF-LDOs
- Output Voltage Range 1.2 V to 3.4 V
- 32-µA Quiescent Current
- Pre-Regulation Support by Separate Power
Inputs - ECO mode
- VIN Range of LDOs:
- LDO1: 2.0 V to 5.5 V
- LDO2: 2.8 V to 5.5 V
- 2 GPIOs
- Thermal Shutdown
- Bypass Switch
- Used with DCDC3 Powering an RF-PA
- Interface
- 26 MHz-MIPI RFFE Interface
- Undervoltage Lockout
- Flexible Power-Up and Power-Down Sequencing
- 2.5-mm × 2.3-mm DSBGA Package with 0.4-mm
Pitch
The TPS657120 provides three configurable step-down converters with up to 2-A output current.This device also has 2 LDO regulators. LDO1 can be supplied from either the input voltage directly or from a pre-regulated supply such as DCDC1 or DCDC2. The input voltage to LDO2 is used as an analog supply input and therefore must be tied to the input voltage at the same voltage level with VINDCDC1/2 and VINDCDC3. The internal power-up and power-down controller is configurable and can support any power-up/power-down sequences (OTP based). All LDOs and DCDC converters are controllable by a MIPI RFFE compatible interface, by pins PWRON, CLK_REQ1 and CLK_REQ2, or both. In addition, there is a nRESET as well as a RFFE address select (ADR_SELECT) input which can alternatively be used as general purpose I/Os with a 1-mA sink capability. The TPS657120 comes in a 6-ball × 5-ball DSBGA package (2.5 mm × 2.3 mm) with a 0.4-mm pitch.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPS657120 PMU for Baseband and RF-PA Power datasheet (Rev. A) | PDF | HTML | 2015年 12月 31日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YFF) | 30 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點