TRF37B32
- Device Family Supports Wide RF Input Range
- TRF37A32: 400 - 1700 MHz
- TRF37B32: 700 - 2700 MHz
- TRF37C32: 1700 - 3800 MHz
- Gain: 10 dB
- Noise Figure: 9.5 dB
- Input IP3: 30 dBm
- 500 mW per Channel Power Dissipation
- Single Ended RF Input
- IF Frequency Range from 30 MHz to 600 MHz
- 45 dB Isolation between Channels
- Low Power Mode Option
- Independent Power Down Control
- Single 3.3V Supply
- No External Matching Required
The TRF37x32 is a wideband dual down converter mixer with integrated IF amplifier. The device employs integrated baluns for single ended RF and LO inputs. The IF amplifier operates from 30 MHz to 600 MHz in an open collector topology to support a variety of IF frequencies and bandwidths. The TRF37x32 provides excellent mixer linearity and noise performance and offers good isolation between channels for operation with diversity applications. The device operates with low power dissipation and further provides an option for a low power mode for power sensitive applications. Each channel can be independently powered down with fast response times to allow operation in time domain duplexed (TDD) applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TRF37x32 Dual Down Converter Mixer With Integrated IF AMP datasheet (Rev. A) | PDF | HTML | 2014年 12月 19日 |
Technical article | How to select a power-efficient narrowband receiver for active antenna-array syste | PDF | HTML | 2016年 4月 12日 | |
EVM User's guide | TRF37x32 EVM User's Guide | 2014年 10月 24日 |
設計與開發
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TRF37B32EVM — TRF37B32 評估模組
The TRF37x32 is a wideband dual down converter mixer with integrated IF amplifier. The device employs integrated baluns for single ended RF and LO inputs. The IF amplifier operates from 30 MHz to 500 MHz in an open collector topology to support a variety of IF frequencies and bandwidths. The (...)
TIDA-00360 — 具 16 位元 ADC 和 100 MHz IF 頻寬的 700–2700 MHz 雙通道接收器參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RTV) | 32 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。