TRSF3232
- Operates With 3-V to 5.5-V VCC Supply
- Operates up to 1 Mbit/s
- Low Supply Current . . . 300 µA Typ
- External Capacitors . . . 4 × 0.1 µF
- Accepts 5-V Logic Input With 3.3-V Supply
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- RS-232 Bus-Pin ESD Protection Exceeds ±15 kV Using Human-Body Model (HBM)
- APPLICATIONS
- Battery-Powered Systems
- PDAs
- Notebooks
- Laptops
- Palmtop PCs
- Hand-Held Equipment
The TRSF3232 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin-to-pin (serial-port connection pins, including GND). This device provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3232 operates at typical data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/µs to 150 V/µs.
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檢視所有 2 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | 3-V to 5.5-V Multichannel RS-232 Compatible Line Driver/Receiver datasheet | 2007年 8月 15日 | |
| * | Errata | Datasheet Errata for SN65/75C3223 SN65/75C3232 SN65/75C3243 TRSF3223/3232/3243 | 2008年 11月 13日 |
設計與開發
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模擬工具
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PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (DW) | 16 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。