TSC2000
- 4-WIRE TOUCH SCREEN INTERFACE
- RATIOMETRIC CONVERSION
- SINGLE 2.7V TO 3.6V SUPPLY
- SERIAL INTERFACE
- INTERNAL DETECTION OF SCREEN TOUCH
- PROGRAMMABLE 8-,10-,OR 12-BIT RESOLUTION
- PROGRAMMABLE SAMPLING RATES
- DIRECT BATTERY MEASUREMENT (0.5V to 6V)
- ON-CHIP TEMPERATURE MEASUREMENT
- TOUCH-PRESSURE MEASUREMENT
- FULL POWER-DOWN CONTROL
- TSSOP-20 PACKAGE
- APPLICATIONS
- PERSONAL DIGITAL ASSISTANTS
- CELLULAR PHONES
- MP3 PLAYERS
SPI is a registered trademark of Motorola.
US Patent No. 624639.
The TSC2000 is a complete PDA analog interface circuit. It contains a complete 12-bit, Analog-to-Digital (A/D) resistive touch screen converter including drivers, the control to measure touch pressure, and an 8-bit Digital-to-Analog (D/A) converter output for LCD contrast control. The TSC2000 interfaces to the host controller through a standard SPI serial interface. The TSC2000 offers programmable resolution and sampling rates from 8- to 12-bits and up to 125kHz to accommodate different screen sizes.
The TSC2000 also offers two battery-measurement inputs, one of which is capable of reading battery voltages up to 6V while operating at only 2.7V. It also has an on-chip temperature sensor capable of reading 0.3°C resolution. The TSC2000 is available in a TSSOP-20 package.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TSC2000: PDA Analog Interface Circuit datasheet | 2002年 1月 30日 | |
* | Errata | PDA Analog Interface Circuit Silicon Errata | 2003年 2月 12日 | |
Application note | Apply TI TSC for Various and Multiple Functions | 2006年 12月 11日 | ||
Application note | Programming Sequences and Tips for TSC2000/2200/230x Applications | 2004年 3月 8日 | ||
Application note | Applying the Current DAC on the TSC2000, TSC2200, TSC2300, and TSC2301 Touch Scr | 2003年 6月 13日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點