TUSB211A-Q1
- AEC-Q100 qualified for automotive applications
- Device temperature grade 2: -40°C to 105°C
- Wide supply voltage range: 2.3 – 6.5V
- Ultra-low USB disconnect and shutdown power consumption
- Provides USB 2.0 high-speed signal conditioning
- Compatible with USB 2.0, OTG 2.0, and BC 1.2
- Support for low-speed, full-speed, and high-speed signaling
- Host or device agnostic
- Supports up to 5m cable length
- Four selectable signal EQ (edge boost along with DC boost) settings through the external pull-down resistor values
- Supports up to 10m cable length with two TUSB211A-Q1 devices
- Scalable solution – devices can be daisy chained for high loss applications
- Pin compatible with TUSB211, 212, 214, 216, and 217A (3.3V)
The TUSB211A-Q1 is a third-generation USB™ 2.0 high-speed signal conditioner designed to compensate both AC loss (due to capacitive load) and DC loss (due to resistive loss) in the transmission channel.
The TUSB211A-Q1 leverages a patented design to speed-up transition edges of USB 2.0 high-speed signal with an edge booster and increases static levels with a DC boost function.
In addition, the TUSB211A-Q1 includes a pre-equalization function to compensate the inter-symbol interference (ISI) jitter in application with longer cable length. USB low-speed and full-speed signal characteristics are unaffected by the TUSB211A-Q1.
The TUSB211A-Q1 improves signal quality without altering packet timing or adding propagation delay or latency.
The TUSB211A-Q1 helps a system to pass the USB 2.0 high-speed near end eye compliance with a cable as long as 5 meters.
The TUSB211A-Q1 is compatible with USB On-The-Go (OTG) and Battery Charging (BC) protocols.
技術文件
設計與開發
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TUSB211RPTREVM — TUSB211 評估模組
TUSB211RPTR 評估模組 (EVM) 旨在提供簡單的方法,以展示 TUSB211A 的訊號調節功能。EVM 已預先配置,並使用標準 USB 纜線將 EVM 上的 Type-B 接頭連接至主機 PC 上的 Type-A 插座;USB 裝置會插入 EVM 的 Type-A 插座。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
X2QFN (RWB) | 12 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。