TUSB8041-Q1
- Four Port USB 3.0 Hub
- USB 2.0 Hub Features
- Multi Transaction Translator (MTT) Hub: Four
Transaction Translators - Four Asynchronous Endpoint Buffers Per
Transaction Translator
- Multi Transaction Translator (MTT) Hub: Four
- Supports Battery Charging
- CDP Mode (Upstream Port Connected)
- DCP Mode (Upstream Port Unconnected)
- DCP Mode Complies with Chinese
Telecommunications Industry Standard
YD/T 1591-2009 - D+/D– Divider Mode
- Supports Operation as a USB 3.0 or USB 2.0
Compound Device - Per Port or Ganged Power Switching and Over-
Current Notification Inputs - OTP ROM, Serial EEPROM or I2C/SMBus Slave
Interface for Custom Configurations:- VID and PID
- Port Customizations
- Manufacturer and Product Strings (not by OTP
ROM) - Serial Number (not by OTP ROM)
- Application Feature Selection Using Pin Selection
or EEPROM/ or I2C/SMBus Slave Interface - Provides 128-Bit Universally Unique Identifier
(UUID) - Supports On-Board and In-System OTP/EEPROM
Programming Via the USB 2.0 Upstream Port - Single Clock Input, 24-MHz Crystal or Oscillator
- No Special Driver Requirements; Works
Seamlessly on any Operating System with USB
Stack Support - 64-Pin HTQFP Package (PAP)
The TUSB8041-Q1 is a four-port USB 3.0 hub. It provides simultaneous SuperSpeed USB and high-speed/full-speed connections on the upstream port and provides SuperSpeed USB, high-speed, full-speed, or low-speed connections on the downstream ports. When the upstream port is connected to an electrical environment that only supports high-speed or full-speed/low-speed connections, SuperSpeed USB connectivity is disabled on the downstream ports. When the upstream port is connected to an electrical environment that only supports full-speed/low-speed connections, SuperSpeed USB and high-speed connectivity are disabled on the downstream ports.
The TUSB8041-Q1 supports per port or ganged power switching and over-current protection, and supports battery charging applications.
An individually port power controlled hub switches power on or off to each downstream port as requested by the USB host. Also when an individually port power controlled hub senses an over-current event, only power to the affected downstream port will be switched off.
A ganged hub switches on power to all its downstream ports when power is required to be on for any port. The power to the downstream ports is not switched off unless all ports are in a state that allows power to be removed. Also when a ganged hub senses an over-current event, power to all downstream ports will be switched off.
The TUSB8041-Q1 downstream ports provide support for battery charging applications by providing Battery Charging Downstream Port (CDP) handshaking support. It also supports a Dedicated Charging Port (DCP) mode when the upstream port is not connected. The DCP mode supports USB devices which support with the USB Battery Charging and Chinese Telecommunications Industry Standard YD/T 1591-2009. In addition, an automatic mode provides transparent support for BC devices and devices supporting Divider Mode charging solutions when the upstream port unconnected.
The TUSB8041-Q1 provides pin strap configuration for some features including battery charging support, and also provides customization though OTP ROM, I2C EEPROM or via an I2C/SMBus slave interface for PID, VID, and custom port and phy configurations. Custom string support is also available when using an I2C EEPROM or the I2C/SMBus slave interface.
The device is available in a 64-pin PAP package and is designed for operation over the temperature range of 40°C to 85°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TUSB8041-Q1 Automotive Four-Port USB 3.0 Hub datasheet (Rev. B) | PDF | HTML | 2016年 1月 15日 |
設計與開發
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The TUSB8041EVM is a functional board design of a single device that implements both a USB 3.0 hub and a USB 2.0 hub. The evaluation module (EVM) can support both SuperSpeed (SS) and USB 2.0 (HS, FS, and LS) operation on its USB ports. This EVM is intended for use in evaluating system (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTQFP (PAP) | 64 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。