TVS3300
- Protection Against 1 kV, 42 Ω IEC 61000-4-5 Surge Test for Industrial Signal Lines
- Max Clamping Voltage of 40 V at 35 A of 8/20 µs Surge Current
- Standoff Voltage: 33 V
- Tiny 1.1 mm2 WCSP and 4 mm2 SON Footprints
- Survives Over 4,000 Repetitive Strikes of 30 A 8/20 µs Surge Current at 125°C
- Robust Surge Protection
- IEC61000-4-5 (8/20 µs): 35 A
- IEC61643-321 (10/1000 µs): 4 A
- Low Leakage Current
- 19 nA Typical at 27°C
- 28 nA Typical at 85°C
- Low Capacitance: 130 pF
- Integrated Level 4 IEC 61000-4-2 ESD Protection
The TVS3300 robustly shunts up to 35 A of IEC 61000-4-5 fault current to protect systems from high power transients or lightning strikes. The device offers a solution to the common industrial signal line EMC requirement to survive up to 1 kV IEC 61000-4-5 open circuit voltage coupled through a 42 Ω impedance. The TVS3300 uses a unique feedback mechanism to ensure precise flat clamping during a fault, assuring system exposure below 40 V. The tight voltage regulation allows designers to confidently select system components with a lower voltage tolerance, lowering system costs and complexity without sacrificing robustness.
In addition, the TVS3300 is available in small 1 mm × 1.1 mm WCSP and 2 mm × 2 mm SON footprints which are ideal for space constrained applications, offering up to a 90 percent reduction in size compared to industry standard SMA and SMB packages. The extremely low device leakage and capacitance ensure a minimal effect on the protected line. To ensure robust protection over the lifetime of the product, TI tests the TVS3300 against 4000 repetitive surge strikes at high temperature with no shift in device performance.
The TVS3300 is part of TIs Flat-Clamp family of surge devices. For more information on the other devices in the family, see the Device Comparison Table
技術文件
設計與開發
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FLAT-CLAMP-TVS-EVM — TVSxx0x 精密突波防護二極體評估模組
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YZF) | 4 | Ultra Librarian |
WSON (DRV) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。