TWL1200
- Level Translator
- VCCA and VCCB Range of 1.1 V to 3.6 V
- Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility
Gap Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273) - Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2500-V Human-Body Model (A114-B)
- 250-V Machine Model (A115-A)
- 1500-V Charged-Device Model (C101)
The TWL1200 is an 19-bit voltage translator specifically designed to seamlessly bridge the
1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). It is optimized for SDIO, UART, and audio functions. The TWL1200 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200 enables system designers to easily interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.The TWL1200 is offered in both 48-ball 0.5-mm ball grid array (BGA) and 49-bump 0.4-mm wafer chip scale package (WCSP) packages. Low static power consumption and small package size make the TWL1200 an ideal choice for mobile-phone applications.
技術文件
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檢視所有 5 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | SDIO, UART, and Audio Voltage-Translation Transceiver datasheet (Rev. A) | 2009年 11月 12日 | |
| Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024年 7月 12日 | |
| Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024年 7月 3日 | |
| Selection guide | Voltage Translation Buying Guide (Rev. A) | 2021年 4月 15日 | ||
| Application note | TWL1200 PCB Design Guidelines | 2009年 7月 6日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YFF) | 49 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點