UCC27424DRG4

具有賦能端和 5-V IN 處理的 4-A/4-A 雙通道閘極驅動器

定價

數量 價格
+

出口分類

*僅供參考

  • 美國 ECCN:null

更多UCC27424資訊

封裝資訊

封裝 | 針腳 SOIC (D) | 8
操作溫度範圍 (°C) -40 to 105
包裝數量 | 運送業者 2,500 | LARGE T&R

UCC27424 的特色

  • Industry-Standard Pin-Out
  • Enable Functions for Each Driver
  • High Current Drive Capability of ±4 A
  • Unique BiPolar and CMOS True Drive Output Stage Provides High Current at MOSFET Miller Thresholds
  • TTL/CMOS Compatible Inputs Independent of Supply Voltage
  • 20-ns Typical Rise and 15-ns Typical Fall Times with 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns with Input Falling and 35 ns with Input Rising
  • 4-V to 15-V Supply Voltage
  • Dual Outputs Can Be Paralleled for Higher Drive Current
  • Available in Thermally Enhanced MSOP PowerPAD™ Package
  • Rated From –40°C to 125°C

UCC27424 的說明

The UCC2742x family of high-speed dual MOSFET drivers can deliver large peak currents into capacitive loads. Three standard logic options are offered – dual-inverting, dual-noninverting, and one-inverting and one-noninverting driver. The thermally enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. It is also offered in the standard SOIC-8 (D) or PDIP-8 (P) packages.

Using a design that inherently minimizes shoot-through current, these drivers deliver 4A of current where it is needed most at the Miller plateau region during the MOSFET switching transition. A unique BiPolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC2742x provides enable (ENB) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8 which were previously left unused in the industry standard pin-out. They are internally pulled up to V DD for active high logic and can be left open for standard operation.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解