UCC2802-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C TA
- Device HBM classification level 2: ±2 kV
- Device CDM classification level C5: >1000 V
- 100-µA typical starting supply current
- 500-µA typical operating supply current
- Operation up to 1 MHz
- Internal soft start
- Internal fault soft start
- Internal leading-edge blanking of the current sense signal
- 1-A totem-pole output
- 70-ns typical response from current-sense to gate drive output
- 1.5% tolerance voltage reference
- Same pinout as UC3842 and UC3842A
The UCC280x-Q1 family of high-speed, low-power integrated circuits contain all of the control and drive components required for off-line and DC-to-DC fixed frequency current-mode switching mode power supplies with minimal parts count.
These devices have the same pin configuration as the UCx84x family, and also offer the added features of internal full-cycle soft start and internal leading-edge blanking of the current-sense input.
The UCC280x-Q1 family offers a variety of package options, temperature range options, choice of maximum duty cycle, and choice of critical voltage levels. Lower reference parts such as the UCC2803-Q1 and UCC2805-Q1 fit best into battery-operated systems, while the higher reference and higher UVLO hysteresis of the UCC2802-Q1 and UCC2804-Q1 make these ideal choices for use in off-line power supplies.
The UCC280x-Q1 series is specified for operation from –40°C to 125°C.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | UCC280x-Q1 Low-Power BiCMOS Current-Mode PWM Controllers datasheet (Rev. D) | PDF | HTML | 2018年 5月 31日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
UCCX802 & UCCX813-2 TINA-TI Startup Reference Design
UCCX802 & UCCX813-2 TINA-TI Steady State Reference Design
UCCx813-2, UCCx802 Families PSpice Transient Model (Rev. B)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點