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Quality, reliability & packaging data download

CAHCT257QWBQBRQ1 ACTIVE

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Rating

Automotive
RoHS Yes
REACH Yes
Device Marking AT257Q
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.047996
97.536986
975370
0.267452
2675
Not Categorized
Proprietary Materials
—
0.000005
0.010161
102
0.000028
0
Precious Metals
Gold
7440-57-5
0.000025
0.050805
508
0.000139
1
Precious Metals
Palladium
7440-05-3
0.001181
2.400016
24000
0.006581
66
Precious Metals
Silver
7440-22-4
0.000001
0.002032
20
0.000006
0
Sub-total
— —
0.049208
100
1000000
0.274205
2742
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.0575
80.000000
800000
0.320412
3204
Thermoplastics
Epoxy
85954-11-6
0.014375
20.000000
200000
0.080103
801
Sub-total
— —
0.071875
100
1000000
0.400514
4005
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
7.8068
97.585000
975850
43.502416
435024
Copper and Its Alloys
Iron
7439-89-6
0.184
2.300000
23000
1.025317
10253
Copper and Its Alloys
Phosphorus
7723-14-0
0.0012
0.015000
150
0.006687
67
Zinc and Its Alloys
Zinc
7440-66-6
0.008
0.100000
1000
0.044579
446
Sub-total
— —
8.0000
100
1000000
44.578999
445790
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.202606
95.120188
951202
1.128997
11290
Precious Metals
Gold
7440-57-5
0.001661
0.779812
7798
0.009256
93
Precious Metals
Palladium
7440-05-3
0.008733
4.100000
41000
0.048664
487
Sub-total
— —
0.213000
100
1000000
1.186916
11869
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
8.317884
87.999999
880000
46.350368
463504
Other Organic Materials
Carbon Black
1333-86-4
0.028356
0.299996
3000
0.158010
1580
Other Organic Materials
Chlorine
7782-50-5
0.000095
0.001005
10
0.000529
5
Thermoplastics
Epoxy
85954-11-6
1.105806
11.699000
116990
6.161966
61620
Sub-total
— —
9.452141
100
1000000
52.670873
526709
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.159446
100.000000
1000000
0.888493
8885
Sub-total
— —
0.159446
100
1000000
0.888493
8885
Total
— —
17.945670
— —
100
1000000

Qualification summary

Type AEC Q100 test # Test spec Min lot qty SS / lot Test name Condition Result Notes
Test group A - accelerated environment stress test
THB/HAST A2 JESD22-A101/JESD22-A110 3 77 Biased HAST 130C/85%RH 96 hours Pass Or equivalent Q100 condition
AC/UHAST A3 JESD22-A102/JESD22-A118 3 77 Unbiased HAST 130C/85%RH for 96 hours Pass Or equivalent Q100 condition
TC A4 JESD22-A104 3 77 Temperature cycle Per grade requirements. See data sheet. Pass —
TC-WBP A4 MIL-STD883 method 2011 1 30 Post temp cycle bond pull Per requirements Pass As applicable per die configuration
HTSL A6 JESD22-A103 1 45 High temp storage bake Per grade requirements. See data sheet. Pass —
Test group B - accelerated lifetime simulation test
HTOL B1 JESD22-A108 3 77 High temperature operating life Per grade requirements. See data sheet. Pass —
ELFR B2 AEC Q100-008 3 800 Early life failure rate Per grade requirements. See data sheet. Pass —
Test group C - package assembly integrity tests
WBS C1 AEC Q100-001 1 30 Wire bond shear Cpk > 1.67 Pass As applicable per die configuration
WBP C2 MIL-STD883 method 2011 1 30 Wire bond pull Cpk > 1.67 Pass As applicable per die configuration
SD C3 JEDEC J-STD-002 1 15 Solderability >95% lead coverage Pass —
PD C4 JESD22-B100 and B108 3 10 Physical dimensions Cpk > 1.67 Pass —
SBS C5 AEC Q100-010 3 5 balls from 10 devices Solder Ball Shear Cpk > 1.67 Pass As applicable per die configuration
Test group D - die fabrication reliability tests
EM D1 — — — Electromigration Per technology requirements Pass —
TDDB D2 — — — Time dependent dielectric breakdown Per technology requirements Pass —
HCI D3 — — — Hot carrier injection Per technology requirements Pass —
BTI D4 — — — Bias temperature instability Per technology requirements Pass —
SM D5 — — — Stress Migration Per technology requirements Pass —
Test group E - electrical verification
HBM E2 AEC Q100-002 1 3 Electrostatic discharge - human body model Per AEC Q100-002 See data sheet —
CDM E3 AEC Q100-011 1 3 Electrostatic discharge - charged device model Per AEC Q100-011 See data sheet —
LU E4 AEC Q100-004 1 3 Latch-up Per AEC Q100-004 Pass As applicable per Q100-004
ED E5 AEC Q100-009 3 30 Electrical distributions Per AEC Q100-009 Pass —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (1Q2025 - 4Q2025) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 231 462 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 30355 442275 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (1Q2025 - 4Q2025) Sample Size Cumulative Sample Size Disposition
QFN Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 13564 167937 Pass
QFN High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 13977 159109 Pass
QFN Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 39039 409693 Pass
QFN Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 22602 296411 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.