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Quality, reliability & packaging data download

DS30EA101SQX/NOPB ACTIVE

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Quality data will change based on assembly site

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking 30EA101
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-3-260C-168 HR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
9.39x108 1.1 55 60 0.7 125 1000 10970 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.05158
94.966307
949663
0.145824
1458
Not Categorized
Proprietary Materials
—
0.000006
0.011047
110
0.000017
0
Precious Metals
Gold
7440-57-5
0.000576
1.060500
10605
0.001628
16
Precious Metals
Palladium
7440-05-3
0.002151
3.960305
39603
0.006081
61
Precious Metals
Silver
7440-22-4
0.000001
0.001841
18
0.000003
0
Sub-total
— —
0.054314
100
1000000
0.153554
1536
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.558735
75.000000
750000
1.579627
15796
Thermoplastics
Epoxy
85954-11-6
0.186245
25.000000
250000
0.526542
5265
Sub-total
— —
0.744980
100
1000000
2.106170
21062
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
15.28016
95.842439
958424
43.199290
431993
Copper and Its Alloys
Iron
7439-89-6
0.37632
2.360409
23604
1.063913
10639
Copper and Its Alloys
Phosphorus
7723-14-0
0.004704
0.029505
295
0.013299
133
Copper and Its Alloys
Zinc
7440-66-6
0.018816
0.118020
1180
0.053196
532
Precious Metals
Silver
7440-22-4
0.263
1.649627
16496
0.743540
7435
Sub-total
— —
15.943000
100
1000000
45.073238
450732
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.929
100.000000
1000000
2.626421
26264
Sub-total
— —
0.929
100
1000000
2.626421
26264
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
14.323464
90.500000
905000
40.494568
404946
Other Organic Materials
Carbon Black
1333-86-4
0.079135
0.499999
5000
0.223726
2237
Thermoplastics
Epoxy
85954-11-6
1.424433
9.000001
90000
4.027084
40271
Sub-total
— —
15.827032
100
1000000
44.745379
447454
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.872996
100.000000
1000000
5.295239
52952
Sub-total
— —
1.872996
100
1000000
5.295239
52952
Total
— —
35.371322
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (1Q2025 - 4Q2025) Sample Size Cumulative Sample Size Disposition
High-Speed BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 154 35970 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (1Q2025 - 4Q2025) Sample Size Cumulative Sample Size Disposition
QFN Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 13564 167937 Pass
QFN High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 13977 159109 Pass
QFN Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 39039 409693 Pass
QFN Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 22602 296411 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.