Definitions
Known Good Die - Die that have the same quality and reliability as the
equivalent packaged part.
Probed die - 25°C DC probed die that have not undergone any special testing.
Also called bare die.
Commercial level KGD - KGD that has been processed to meet the same
parameters as the equivalent commercial temperature device (usually 0°C
to 70°C)
Military level KGD - KGD that has been processed to meet the same parameters
as the equivalent military temperature device (-55°C to 125°C)
Nomenclature
Unpackaged Die - DSP KGD
| Example: |
SMJ |
320 |
C40 |
KGD |
M |
40 |
C |
T |
|
1 |
2 |
3 |
4 |
5 |
6 |
7 |
8 |
| 1: Prefix |
| SM |
= |
Commercial Processing |
| SMJ |
= |
MIL-PRF-38535 (QML) |
| TMP |
= |
Commercial Level |
| 2: 320 DSP Family Designator |
| 3: 320 DSP Product Designator |
| C |
= |
CMOS 5.0 V |
|
31 |
= |
C31 |
|
67 |
= |
C6701 |
| E |
= |
CMOS EPROM |
|
32 |
= |
C32 |
|
80 |
= |
C80 |
| F |
= |
CMOS FLASH |
|
40 |
= |
C40 |
|
206 |
= |
F206 |
| LC |
= |
CMOS 3.3 V |
|
50 |
= |
C50 |
|
240 |
= |
F240 |
| 30 |
= |
C30 |
|
62 |
= |
C6201 |
|
549 |
= |
LC549 |
| 4: Package Type: Known Good Die |
| 5: Temperature Range |
| M |
= |
-55°C to 125°C |
| A |
= |
-40°C to 85°C |
| L |
= |
0°C to 70°C |
| S |
= |
Special Per Data Sheet |
| 6: Speed Designator |
| 33 |
= |
33 MHz |
| 40 |
= |
40 MHz |
| 50 |
= |
50 MHz |
| 66 |
= |
66 MHz |
| 7: Current Die Revision (See Data Sheet) |
| 8: Temporary Wire Bond (If Applicable) |
Unpackaged Wafer
| Example: |
MP1 |
TL431 |
-W |
|