>> Semiconductor Home > Products > Military > Military Products Overview > Unpackaged Die >

Resources

   KGD Definitions and Nomenclature
Gray Rule

New and Featured!

Products
> Digital Signal Processors
> Analog and Mixed-Signal
> Digital Logic
> FIFOs
> Programmable Array Logic
   (PAL) and PROM
> Unpackaged Die Products
   > DSP KGD
   > Where to buy TI Die
      Products
   > Nomenclature
> Multichip Module
> Imaging Solutions
> Obsolete Parts
 

   320C31 KGD Definitions

Known Good Die - Die that have the same quality and reliability as the equivalent packaged part.

Probed die - 25°C DC probed die that have not undergone any special testing. Also called bare die.

Commercial level KGD - KGD that has been processed to meet the same parameters as the equivalent commercial temperature device (usually 0°C to 70°C)

Military level KGD - KGD that has been processed to meet the same parameters as the equivalent military temperature device (-55°C to 125°C)

Nomenclature

Unpackaged Die - DSP KGD
Example: SMJ 320 C40 KGD M 40 C T
1 2 3 4 5 6 7 8
1: Prefix
SM = Commercial Processing
SMJ = MIL-PRF-38535 (QML)
TMP = Commercial Level
2: 320 DSP Family Designator
3: 320 DSP Product Designator
C = CMOS 5.0 V 31 = C31 67 = C6701
E = CMOS EPROM 32 = C32 80 = C80
F = CMOS FLASH 40 = C40 206 = F206
LC = CMOS 3.3 V 50 = C50 240 = F240
30 = C30 62 = C6201 549 = LC549
4: Package Type: Known Good Die
5: Temperature Range
M = -55°C to 125°C
A = -40°C to 85°C
L = 0°C to 70°C
S = Special Per Data Sheet
6: Speed Designator
33 = 33 MHz
40 = 40 MHz
50 = 50 MHz
66 = 66 MHz
7: Current Die Revision (See Data Sheet)
8: Temporary Wire Bond (If Applicable)

Unpackaged Wafer
Example: MP1 TL431 -W