Lead finish/ball material & tin plating
This page provides details on TI's lead finish and solder ball composition options, as well as our tin plating process.
To find device-specific composition, use our Material content search tool.
Material options
| Material | Standard | Pb-free |
|---|---|---|
| Lead finish | 85% Sn, 15% Pb | Matte Sn |
| Solder ball | SnPb | SnAgCu |
Tin plating process
TI’s Tin plate process meets and/or exceeds qualification and monitoring standards set in JESD201, with Class 1 and Class 2 levels inspection per JESD 22A121. In addition, TI has taken the following actions for Tin plating products to meet JESD201 Class 2 requirement:
- Leadframe base material (alloy) control
- Tin plating control (chemistry, process and thickness)
- Post-plate annealing (150C minimum within 24 hours of plating)
TI uses leadframe materials such as Cu194, Cu7025, EFTEC-64T, TAMAC2, and TAMAC4.
Tin whiskers
Tin whiskers occur due to stresses in the plating process and are known to occur on tin-plated or tin-alloy plated parts. Tin whisker growth creates a reliability concern because they may bridge the gap between leads, causing electrical shorting. As a whisker mitigation measure, TI:
- Anneals matte tin post-plated leadframe-based packages with formed leads for 1 hour at 150°C within 24 hours of plating. This is the industry-accepted method for controlling whisker growth.
- Maintains minimum "as-plated" thickness of 7 μm, with 15% thinning allowed after lead trim and form for electroplated devices. This thickness conforms to the recognized tin whisker mitigation practices published in JEDEC/IPC JP002.
- Applies SnAgCu alloy to minimum 5 μm thickness after lead trim and form for hot solder dipped devices. This process is considered "whisker-free" per JEDEC/IPC JP002.
Tin whisker test results (per JESD201)
Test summary
All leadframe materials tested show consistent whisker mitigation performance across different stress test conditions.
Materials tested
- C19400 (Cu194) - Copper alloy
- C07025 (Cu7025) - Copper alloy
- C18045 (EFTEC-64T) - Copper alloy
- TAMAC 2 - Leadframe material
- TAMAC 4 - Leadframe material
Test results
| Stress Test Condition | Duration | Result (All materials listed above | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Temperature Cycling (-55°C/+85°C or -40°C/+85°C) | 1500 cycles | <45 μm whiskers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High Temperature Humidity Storage (55°C/85%RH) | 4000 hours | <40 μm whiskers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Humidity Storage (30°C/60%RH) | 4000 hours | <40 μm whiskers (some tested with no precondition)* | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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*For Temperature Humidity Storage testing, materials C19400, C07025, C18045, TAMAC 2, and TAMAC 4 were tested without Precondition A. |
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