LP-EM-CC2340R53

LaunchPad™ development kit for CC2340R SimpleLink™ family of 2.4GHz multi-standard wireless MCUs

LP-EM-CC2340R53

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Overview

This LaunchPad™ development kit, featuring the CC2340R53, is used to speed development with the CC2340R SimpleLink™ family of 2.4GHz wireless MCUs with support for Bluetooth® Low Energy, Thread, Zigbee®, and 2.4 GHz proprietary protocols. Software support is provided by the compatible SimpleLink™ low-power software development kit. This is a split LaunchPad™ development kit which means that it does not contain an XDS debugger. Recommended debuggers are LP-XDS110 or LP-XDS110ET.

Features
  • Access all I/O signals with the BoosterPack™ plug-in module connectors
  • Connect your LaunchPad™ development kit to the cloud with Bluetooth® Low Energy on your smartphone
  • LP-XDS110ET or LP-XDS110 debbugger (sold seprately) required for software development and RF evaluation

  • Cable for debugging (debugger not included)
  • Quick start guide

Low-power 2.4-GHz products
CC2340R5 SimpleLink™ 32bit Arm® Cortex®-M0+ 2.4GHz wireless MCU with 512kB flash

Order & start development

Evaluation board

LP-EM-CC2340R53 — LaunchPad™ development kit for CC2340R SimpleLink™ family of 2.4GHz multi-standard wireless MCUs

Online training

SIMPLELINK-ACADEMY-CC23XX — Simplelink™ CC23xx Academy

Supported products & hardware

SIMPLELINK-ACADEMY-CC23XX Simplelink™ CC23xx Academy

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Latest version
Version: 1.00.00.00
Release date: 03 Apr 2023
Products
Low-power 2.4-GHz products
CC2340R2 SimpleLink™ 32bit Arm® Cortex®-M0+ 2.4GHz wireless MCU with 256kB flash CC2340R5 SimpleLink™ 32bit Arm® Cortex®-M0+ 2.4GHz wireless MCU with 512kB flash
Automotive wireless connectivity products
CC2340R5-Q1 Automotive-qualified SimpleLink™ Bluetooth® Low Energy wireless MCU with 512-kB flash
Hardware development
Evaluation board
LP-EM-CC2340R5 CC2340R5 LaunchPad™ development kit for SimpleLink™ Bluetooth® 5.3 Low Energy MCU LP-EM-CC2340R53 LaunchPad™ development kit for CC2340R SimpleLink™ family of 2.4GHz multi-standard wireless MCUs

Release Infomation

Initial release of CC23xx academy

Software development kit (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

Supported products & hardware
Download options
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SIMPLELINK-LOWPOWER-F3-SDK SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

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Latest version
Version: 8.40.02.01
Release date: 28 Feb 2025

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download Linux Zip for SimpleLink Low Power F3 SDK  — 449680 K

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download macOS Zip for SimpleLink Low Power F3 SDK  — 436517 K

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Products
Low-power 2.4-GHz products
CC2340R2 SimpleLink™ 32bit Arm® Cortex®-M0+ 2.4GHz wireless MCU with 256kB flash CC2340R5 SimpleLink™ 32bit Arm® Cortex®-M0+ 2.4GHz wireless MCU with 512kB flash CC2755R10 SimpleLink™ 32-bit Arm® Cortex®-M33 Bluetooth® Low Energy wireless MCU with 1MB flash
Automotive wireless connectivity products
CC2340R5-Q1 Automotive-qualified SimpleLink™ Bluetooth® Low Energy wireless MCU with 512-kB flash CC2745R10-Q1 Automotive SimpleLink™ Bluetooth® 6.0 LE wireless MCU with 1MB flash, HSM, APU, CAN-FD
Hardware development
Evaluation board
LP-EM-CC2340R5 CC2340R5 LaunchPad™ development kit for SimpleLink™ Bluetooth® 5.3 Low Energy MCU LP-EM-CC2340R53 LaunchPad™ development kit for CC2340R SimpleLink™ family of 2.4GHz multi-standard wireless MCUs LP-EM-CC2745R10-Q1 CC2745R10-Q1 LaunchPad™ development kit for SimpleLink™ 2.4GHz wireless MCU

Release Infomation

The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx wireless MCU users by packaging essential software components, such as:

  • Bluetooth® Low Energy (BLE) protocol stack

  • Zigbee® protocol stack supporting low power wireless mesh networks

  • Proprietary RF layer

  • TI Drivers

All of the above are provided in one easy-to-use software package along with example applications and documentation.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit TI SimpleLink Wireless Connectivity.

This is version 8.40.02.01 of the SimpleLink Low Power F3 SDK.

Supported Features and Limitations

CC23xx

TI Crypto Driver Overview Support Status Additional Comment AES-CCM Supported AES-ECB Supported AESECB_oneStepDecrypt, AESECB_setupDecrypt not supported AES-GCM Supported AES-CTR Supported AES-CBC Supported AESCBC_oneStepDecrypt, AESCBC_setupDecrypt not supported AES-CTR-DRBG Supported AES-CMAC Supported SHA-256 Supported ECDH Supported ECIES Supported RNG Supported TRNG Not Supported

CC27xx

TI Crypto Driver Overview Support Status Additional Comment AES-CCM Supported LAES + HSM AES-ECB Supported LAES + HSM AES-GCM Supported LAES + HSM AES-CTR Supported LAES + HSM AES-CBC Supported LAES + HSM AES-CTR-DRBG Not Supported This is supported via RNG AES-CMAC Supported LAES + HSM ECDH Supported HSM ECDSA Supported HSM RNG Supported HSM (AES-CTR-DRBG) TRNG Supported HSM

LAES & HSM Limitations

The CC27xx family of devices now include a Hardware Security Module (HSM) for cryptographic and key storage features.

For crypto drivers that support the HSM and LAES, a failure in the HSM bootup process will be cached in the driver’s handle. If the user attempts to perform an HSM operation later, it will return an error due to the cached initialization error. LAES operations would continue to function without issue in that case.

For drivers that support running operations on both hardware accelerators, a switch has been implemented so that the driver knows which engine to use to execute the operation on. This switch is part of the cryptography operation’s key. The key encoding associated with each key that is included as part of the user-provided data to the driver is where the user can specify which hardware accelerator to use.

  • To leverage the HSM hardware accelerator, the user has to call ‘CryptoKeyPlaintextHSM_initKey(..)’ API and pass in the plaintext key as well as the key length.

  • To leverage the LAES hardware accelerator, the user has to call ‘CryptoKeyPlaintext_initKey()(..)’ API and pass in the plaintext key as well as the key length.

NOTE:

  • Mass erasing the CC27xx without retaining protected sectors will result in the erasure of the HSM firmware. Please see the Quick Start Guide: Build your first program for the CC23xx or CC27xx device on how to re-flash the HSM firmware.

What's new

  • Certified Zigbee Stack.

  • Zigbee OTA support.

  • Minor bug fixes in SCCM.

TI's Standard Terms and Conditions for Evaluation Items apply.

Design files

Technical documentation

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Type Title Date
Certificate LP-EM-CC2340R53 EU Declaration of Conformity (DoC) (Rev. A) 24 Mar 2025
EVM User's guide LP-EM-CC2340R53 EVM User's Guide PDF | HTML 11 Dec 2024
Certificate LP-EM-CC2340R53 EU Declaration of Conformity (DoC) 14 Nov 2024

Support & training

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