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PMP23496

8kW hot-swap reference design for 48V artificial intelligence servers

PMP23496

Design files

Overview

With the advancements in artificial intelligence (AI) and machine learning (ML), enterprise servers have become power-intensive as these servers simultaneously process a large amount of data and storage. The steady-state power rating of each server motherboard has gone up 5kW to 6kW, in contrast to 1kW to 2kW for general servers. However, the form factor remains the same, imposing system design challenges due to increased power density. The load amplitude, slew-rate, and frequency of transient loads on AI servers have increased by three to four times compared to general servers. Considering these requirements, this reference design is developed using the LM5066I hot-swap controller to provide a robust and reliable input power-path-protection design in high-power server backplane systems with a nominal input voltage of 54V.

Features
  • Capable of carrying 150A of RMS load current at an ambient temperature of 70°C with a nominal input voltage of 54V (8.1kW design)
  • Ability to safely turn off nine MOSFETs (effective CISS of 150nF) during an output hot-short event
  • Supports high-frequency fast slew-rate load transients with large amplitudes
Output voltage options PMP23496.1
Vin (Min) (V) 40
Vin (Max) (V) 60
Vout (Nom) (V) 54
Iout (Max) (A) 150
Output Power (W) 8100
Isolated/Non-Isolated Non-Isolated
Input Type DC
Topology Hot Swap
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

PDF | HTML
TIDT405.PDF (3774 K)

Test results for the reference design, including efficiency graphs, test prerequisites and more

TIDMD42.PDF (348 K)

Detailed schematic diagram for design layout and components

TIDMD46.PDF (159 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDMD44.PDF (288 K)

Detailed overview of design layout for component placement

TIDMD45.ZIP (3335 K)

Files used for 3D models or 2D drawings of IC components

TIDCGQ3.ZIP (1037 K)

Design file that contains information on physical board layer of design PCB

Products

Includes TI products in the design and potential alternatives.

eFuses & hot swap controllers

LM5066I10-V to 80-V hot swap controller with improved current, voltage and power monitoring accuracy

Data sheet: PDF | HTML

Technical documentation

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Type Title Date
* Test report 8kW Hot-Swap Reference Design For 48V Artificial Intelligence Servers PDF | HTML Aug. 08, 2024

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