The TPS543B25TEVM is an evaluation module (EVM) for the TPS543B25T integrated circuit (IC). The TPS543B25T is a synchronous step-down converter with thermally enhanced packaging (TEP), which removes the top side mold compound of a standard over-molded IC in order to improve thermal performance when used with a heat sink. The EVM features low-profile external components and two threaded holes with which to mount any heat sink on top of the converter. The TPS543B25TEVM uses its exposed-die packaging in conjunction with any mounted heat sink to minimize die temperature, lessen thermal derating and improve system efficiency, especially in high ambient temperature environments. Heat sink not included.
| Type | Title | Date | ||
|---|---|---|---|---|
| EVM User's guide | TPS543B25TEVM SWIFT™ Step-Down Converter Evaluation Module User's Guide | PDF | HTML | 21 Nov 2023 | |
| Certificate | TPS543B25TEVM EU Declaration of Conformity (DoC) | 06 Oct 2023 |
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