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CC2564CMSP432BTBLESW
MSP432 MCU 向け CC2564C TI デュアルモード Bluetooth® スタック
CC2564CMSP432BTBLESW
概要
TI’s CC2564C Dual-mode Bluetooth® stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.2 specification. The Bluetooth stack is fully qualified (QDID 85355 and QDID 69886), provides simple command line based sample applications to speed development, and upon request has MFI capability.
For a complete evaluation solution, the CC2564C Dual-mode Bluetooth stack works directly with the TI hardware development kits: MSP-EXP432P401R, BOOST-CCEMADAPTER and CC256XCQFN-EM. For audio and voice applications, the CC3200AUDBOOST can be connected to the MSP-EXP432P401R and BOOST-CCEMADAPTER. Moreover, the stack that is available for the MSP432 MCU is certified and royalty-free.
For a complete evaluation solution, the CC2564C Dual-mode Bluetooth stack works directly with the TI hardware development kits: MSP-EXP432P401R, BOOST-CCEMADAPTER and CC256XCQFN-EM. For audio and voice applications, the CC3200AUDBOOST can be connected to the MSP-EXP432P401R and BOOST-CCEMADAPTER. Moreover, the stack that is available for the MSP432 MCU is certified and royalty-free.
The software works with the CC256XCQFN-EM board via the BOOST-CCEMADAPTER and MSP-EXP432P401R boards which provides a complete Bluetooth BT/EDR/LE HCI solution, reducing design effort and enabling fast time to market.
機能
- Supports Dual-mode Bluetooth 4.2 - Bluetooth certified and royalty free
- Supports LE Secure Connection
- Supports LE Dual Mode Topology and Link Layer Topology with CC2564C
- Bluetooth stack is fully qualified (QDID 85355 and QDID 69886)
- Fully Thread safe
- Sample apps are available for the MSP-EXP432P401R LaunchPad with the support of the BOOST-CCEMADAPTER
- Fully Documented API Interface
- Supports CCS, IAR, KEIL IDE
- Classic Profiles Available
- Advanced Audio Distribution Profile (A2DP): Internal SBC encoding/decoding is implemented (Assisted A2DP) – please note that due to lack of PCM routing in MSP Launchpad, manual prototyping is required to interface an external audio codec EVM, e.g. CC3200AUDBOOST
- Audio/Video Transport Protocols (AVDTP)
- Audio/Video Remote Control Profile (AVRCP)
- Generic Access Profile (GAP)
- Headset Profile (HSP) and Hands Free Profile (HFP): please note that due to lack of PCM routing in MSP Launchpad, manual prototyping is required to interface an external audio codec EVM, e.g. CC3200AUDBOOST
- Human Interface Device Profile (HID)
- Message Access Profile (MAP)
- Phonebook Access Profile (PBAP)
- Serial Port Profile (SPP)
- Bluetooth Low Energy Profiles Available
- Alert Notification Service (ANS)
- Battery Service (BAS)
- Cycle Speed and Cadence Service (CSCS)
- Device Information Service (DIS)
- Find Me Profile (FMP)
- Generic Access Profile Service (GAPS)
- Generic Attribute Profile (GATT)
- Health Thermometer Service (HTS)
- Heart Rate Service (HRS)
- Human Interface Device Service (HIDS)
- Immediate Alert Service (IAS)
- Link Loss Service (LLS)
- Phone Alert State Service (PASS)
- Proximity Profile (PXP)
- TX Power Service (TPS)
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技術資料
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5 をすべて表示
| 種類 | タイトル | 最新の英語版をダウンロード | 日付 | |||
|---|---|---|---|---|---|---|
| その他の技術資料 | Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) | PDF | HTML | 2021年 12月 20日 | |||
| ユーザー・ガイド | CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) | PDF | HTML | 2021年 12月 20日 | |||
| ユーザー・ガイド | CC2564B to CC2564C Migration Guide (Rev. B) | PDF | HTML | 2021年 12月 1日 | |||
| ユーザー・ガイド | CC256xC QFN EM User Guide (Rev. B) | 2020年 3月 11日 | ||||
| ユーザー・ガイド | EM Adapter BoosterPack User's Guide (Rev. A) | 2013年 4月 15日 |