X1QFN: The industry's smallest QFN package
Expanding the Standard Logic Products ecosystem, TI is introducing the first X1QFN package. This is the smallest QFN package available in the industry today at just 2.5x2.1x0.5mm in the 14-pin count, 2.5x2.5x0.5mm in the 16-pin count, and 2.5x3.3x0.5mm, 20-pin count. The X1QFN is 55% smaller than most QFN packages.
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Hello. This is Igal from SLL. I'm a worldwide marketing engineer in the Standard Linear and Logic group at Texas Instruments. I'm so excited to introduce you to world's newest and smallest package from Texas Instruments called X1QFN. As they all say, bigger isn't always better.
X1QFN is a new package offered by Texas Instruments. In fact, it's the world's smallest package available for 14, 16, and 20 pin devices. At just 2.5 by 3.3 by 0.5 millimeter and at 0.4 millimeter pitch for a 20-pin device, it presents a major change in the industry for small scale packages.
Such small package sizes were only offered for little logic function before. But with aggressive die shrinking, we have brought larger functions to such a small scale package. This allows for incorporation off large logic devices into form factor such as ever compacting smartwatches and mobile devices, internet connected industrial devices, as well as communications equipment.
We believe that any customer looking to fit advanced logic function in a very small form factor device will come to find the X1QFN invaluable. The X1QFN package is revolutionary. And its the next big step in small package innovation. Our investments in packaging have lead us to release this new small sized package.
From the large packages such as QSOP and TSSOP, we continued to the journey of developing small packages options. This leads to the release of BGA packages and eventually QFN micro-QFN. With the new X1QFN, we are taking small to the next level by enabling nearly 30% space saving on the PCB.
The 16-pin variety of the package is used for the HC595B shift register, which offers a lower propagation delay and wider operating temperature than other QFN packages. This package is much smaller than any competitor QFN and micro-QFN offering. This comes at a very competitive price point for the board saving involved.
Ideal markets includes certain industrial applications such as internet connected devices, communication, and consumer electronics. Smaller, faster, quality, and extend temperature. That's the HC595. The HC595 16-pin shift register benchmark shows clearly its advantages. They're 29% shorter in size, the easy manufacturing option with a wide temperature range, and on top of that offers you a high voltage tolerance input range.
Another device offered X1QFN is the LVC244A, a 20-pin buffer/driver. The 20-pin version of the package used for the LVC244A is vastly smaller than the industry DQFN option. It makes possible aggressive [? realistic ?] board saving at a very competitive price point.
This small package is also more robust than other packages due to the wider operating temperature which is ideal for markets like personal electronics, telecommunication, and industrial application. Smaller, trendier, better quality, and a wider temperature range. The LVC244A benchmark shows clearly the key advantages of the X1QFN 20-pin package. With 27% shorter in size and easy manufacturing option, it's for sure the leader of the pack.
Thank you very much for watching the X1QFN introduction. And we're expecting a whole slew of devices coming out in the upcoming months. Thank you.
This video is part of a series
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Logic and voltage translation
video-playlist (20 videos)