LMT70
0.1C analog temperature sensor, -5.19 mV/C, high-precision matched pairs, output enable pin
LMT70
- Accuracy:
- ±0.05°C (typ) or ±0.13°C (max) from 20°C to 42°C
- ±0.2°C (max) from -20°C to 90°C
- ±0.23°C (max) from 90°C to 110°C
- ±0.36°C (max) from -55°C to 150°C
- Wide Temperature Range: −55°C to 150°C
- Matching of Two Adjacent LMT70A on Tape and Reel: 0.1°C (max) at 30°C
- Very Linear Analog Temperature Sensor with Output Enable Pin
- NTC Output Slope: -5.19 mV/°C
- Output On/Off Switch with RDS on < 80 Ω
- Wide Power Supply Range: 2.0 V to 5.5 V
- Low Power Supply Current: 9.2 µA (typ)12 µA (max)
- Ultra Small 0.88 mm by 0.88 mm 4-bump WLCSP (DSBGA) Package
All trademarks are the property of their respective owners.
The LMT70 is an ultra-small, high-precision, low-power CMOS analog temperature sensor with an output enable pin. Applications for the LMT70 include virtually any type of temperature sensing where cost-effective, high precision and low-power are required, such as Internet of Things (IoT) sensor nodes, medical thermometers, high-precision instrumentation and battery powered devices. The LMT70 is also a great replacement for RTD and precision NTC/PTC thermistors.
Its output enable pin allows multiple LMT70s to share one ADC channel, thus simplifying ADC calibration and reducing the overall system cost for precision temperature sensing. The LMT70 also has a linear and low impedance output allowing seamless interface to an off-the-shelf MCU/ADC. Dissipating less than 36µW, the LMT70 has ultra-low self-heating supporting its high-precision over a wide temperature range.
The LMT70A provides unparalleled temperature matching performance of 0.1°C (max) for two adjacent LMT70A's picked from the same tape and reel. Therefore, the LMT70A is an ideal solution for energy metering applications requiring heat transfer calculations.
Similar products you might be interested in
Drop-in replacement with upgraded functionality to the compared device
Similar functionality to the compared device
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | LMT70, LMT70A ±0.05°C Precision Analog Temperature Sensor, RTD and Precision NTC Thermistor IC datasheet (Rev. A) | PDF | HTML | 11 May 2015 |
Application note | Ultra-Small, Precision Analog Temperature Sensor Measurement With ADC (Rev. A) | 24 Aug 2021 | ||
Technical article | How to design an infrared thermometer quickly | PDF | HTML | 07 Apr 2020 | |
Application note | Temperature sensors: PCB guidelines for surface mount devices (Rev. A) | 18 Jan 2019 | ||
Application note | Wearable Temp-Sensing Layout Considerations Optimized for Thermal Response (Rev. B) | 23 Oct 2018 | ||
Application note | Design Considerations for Measuring Ambient Air Temperature (Rev. B) | 10 Sep 2018 | ||
Technical article | Real-time temperature sensing with dual-mode connectivity | PDF | HTML | 03 Nov 2016 | |
Technical article | Tips and tricks for human body temperature measurement with analog temperature sen | PDF | HTML | 08 Sep 2015 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
LMT70EVM — LMT70 Evaluation Module Precise Analog Output Temperature Sensor with Output Enable
The LMT70EVM allows users to evaluate the performance of the LMT70 temperature sensor. The EVM comes in a USB stick form factor package with an onboard MSP430F5528 microcontroller that interfaces with both the USB port and the LMT70 device. The EVM also comes with perforated slots that the user can (...)
TIDA-01576 — High accuracy analog input module reference design with 16-bit 1-MSPS dual simultaneous-sampling ADC
TIDA-010019 — RTD replacement for cold junction compensation reference design in a temperature sensor
TIDA-01214 — Isolated, High-Accuracy Analog Input Module Reference Design Using 16-Bit ADC and Digital Isolator
TIDA-00721 — Passive NFC Temperature Patch Reference Design
TIDA-00824 — Human Skin Temperature Sensing for Wearable Applications Reference Design
TIDA-00452 — Temperature Sensor for Wearable Devices Reference Design
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
DSBGA (YFQ) | 4 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.