SLVSDR2B November   2018  – March 2021 ADC12DJ3200QML-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC Specifications
    6. 6.6  Electrical Characteristics: Power Consumption
    7. 6.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 6.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagrams
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
        1. 7.3.1.1 Analog Input Protection
        2. 7.3.1.2 Full-Scale Voltage (VFS) Adjustment
        3. 7.3.1.3 Analog Input Offset Adjust
      2. 7.3.2 ADC Core
        1. 7.3.2.1 ADC Theory of Operation
        2. 7.3.2.2 ADC Core Calibration
        3. 7.3.2.3 ADC Overrange Detection
        4. 7.3.2.4 Code Error Rate (CER)
      3. 7.3.3 Timestamp
      4. 7.3.4 Clocking
        1. 7.3.4.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 7.3.4.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 7.3.4.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 7.3.4.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 7.3.4.3.2 Automatic SYSREF Calibration
      5. 7.3.5 Digital Down Converters (Dual-Channel Mode Only)
        1. 7.3.5.1 Numerically-Controlled Oscillator and Complex Mixer
          1. 7.3.5.1.1 NCO Fast Frequency Hopping (FFH)
          2. 7.3.5.1.2 NCO Selection
          3. 7.3.5.1.3 Basic NCO Frequency Setting Mode
          4. 7.3.5.1.4 Rational NCO Frequency Setting Mode
          5. 7.3.5.1.5 NCO Phase Offset Setting
          6. 7.3.5.1.6 NCO Phase Synchronization
        2. 7.3.5.2 Decimation Filters
        3. 7.3.5.3 Output Data Format
        4. 7.3.5.4 Decimation Settings
          1. 7.3.5.4.1 Decimation Factor
          2. 7.3.5.4.2 DDC Gain Boost
      6. 7.3.6 JESD204B Interface
        1. 7.3.6.1 Transport Layer
        2. 7.3.6.2 Scrambler
        3. 7.3.6.3 Link Layer
          1. 7.3.6.3.1 Code Group Synchronization (CGS)
          2. 7.3.6.3.2 Initial Lane Alignment Sequence (ILAS)
          3. 7.3.6.3.3 8b, 10b Encoding
          4. 7.3.6.3.4 Frame and Multiframe Monitoring
        4. 7.3.6.4 Physical Layer
          1. 7.3.6.4.1 SerDes Pre-Emphasis
        5. 7.3.6.5 JESD204B Enable
        6. 7.3.6.6 Multi-Device Synchronization and Deterministic Latency
        7. 7.3.6.7 Operation in Subclass 0 Systems
      7. 7.3.7 Alarm Monitoring
        1. 7.3.7.1 NCO Upset Detection
        2. 7.3.7.2 Clock Upset Detection
      8. 7.3.8 Temperature Monitoring Diode
      9. 7.3.9 Analog Reference Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Dual-Channel Mode
      2. 7.4.2 Single-Channel Mode (DES Mode)
      3. 7.4.3 JESD204B Modes
        1. 7.4.3.1 JESD204B Output Data Formats
        2. 7.4.3.2 Dual DDC and Redundant Data Mode
      4. 7.4.4 Power-Down Modes
      5. 7.4.5 Test Modes
        1. 7.4.5.1 Serializer Test-Mode Details
        2. 7.4.5.2 PRBS Test Modes
        3. 7.4.5.3 Ramp Test Mode
        4. 7.4.5.4 Short and Long Transport Test Mode
          1. 7.4.5.4.1 Short Transport Test Pattern
          2. 7.4.5.4.2 Long Transport Test Pattern
        5. 7.4.5.5 D21.5 Test Mode
        6. 7.4.5.6 K28.5 Test Mode
        7. 7.4.5.7 Repeated ILA Test Mode
        8. 7.4.5.8 Modified RPAT Test Mode
      6. 7.4.6 Calibration Modes and Trimming
        1. 7.4.6.1 Foreground Calibration Mode
        2. 7.4.6.2 Background Calibration Mode
        3. 7.4.6.3 Low-Power Background Calibration (LPBG) Mode
      7. 7.4.7 Offset Calibration
      8. 7.4.8 Trimming
      9. 7.4.9 Offset Filtering
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Streaming Mode
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
      2. 7.6.2 SYSREF Calibration Registers (0x2B0 to 0x2BF)
      3. 7.6.3 Alarm Registers (0x2C0 to 0x2C2)
  8. 8 Application Information Disclaimer
    1. 8.1 Application Information
      1. 8.1.1 Analog Inputs
      2. 8.1.2 Analog Input Bandwidth
      3. 8.1.3 Clocking
      4. 8.1.4 Radiation Environment Recommendations
        1. 8.1.4.1 Single Event Latch-Up (SEL)
        2. 8.1.4.2 Single Event Functional Interrupt (SEFI)
        3. 8.1.4.3 Single Event Upset (SEU)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 RF Input Signal Path
        2. 8.2.2.2 Calculating Values of AC-Coupling Capacitors
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZMX|196
  • NWE|196
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics: DC Specifications

typical values at TA = 25°C, VA19 = 1.9 V, VA11 = 1.1 V, VD11= 1.1 V, default full-scale voltage (FS_RANGE_A = FS_RANGE_B = 0xA000), input signal applied to INA± in single-channel modes, fIN = 347 MHz, AIN = –1dBFS, fCLK = maximum-rated clock frequency, filtered 1-VPP sine-wave clock, JMODE = 1, and background calibration (unless otherwise noted); minimum and maximum values are at nominal supply voltages and over the operating temperature range provided in the Recommended Operating Conditions table
PARAMETERTEST CONDITIONSSUBGROUP(1)MINTYPMAXUNIT
DC ACCURACY
ResolutionResolution with no missing codes12Bits
DNLDifferential nonlinearityMaximum positive excursion from ideal step size0.4LSB
Maximum negative excursion from ideal step size–0.3LSB
INLIntegral nonlinearityMaximum positive excursion from ideal transfer function3LSB
Maximum negative excursion from ideal transfer function–2LSB
ANALOG INPUTS (INA+, INA–, INB+, INB–)
VOFFOffset errorCAL_OS = 0±2.0mV
CAL_OS = 1±0.5mV
VOFF_ADJInput offset voltage adjustment rangeAvailable offset correction range (see CAL_OS bit in the CAL_CFG0 register or the OADJ_A_FG0_VINA register)±55mV
VOFF_DRIFTOffset driftForeground calibration at nominal temperature only23µV/°C
Foreground calibration at each temperature0
VIN_FSRAnalog differential input full-scale rangeDefault full-scale voltage (FS_RANGE_A = FS_RANGE_B = 0xA000)[1, 2, 3]750810850mVPP
Maximum full-scale voltage (FS_RANGE_A = FS_RANGE_B = 0xFFFF)1050
Minimum full-scale voltage (FS_RANGE_A = FS_RANGE_B = 0x2000)490
VIN_FSR_DRIFTAnalog differential input full-scale range driftDefault FS_RANGE_A and FS_RANGE_B setting, foreground calibration at nominal temperature only, inputs driven by 50-Ω source, includes effect of RIN drift–0.01%/°C
Default FS_RANGE_A and FS_RANGE_B setting, foreground calibration at each temperature, inputs driven by 50-Ω source, includes effect of RIN drift–0.022
VIN_FSR_MATCHAnalog differential input full-scale range matchingMatching between INA± and INB±, default setting, dual-channel mode1%
RINSingle-ended input resistance to AGNDEach input pin is terminated to AGND, measured at TA = 25°C[1]485052Ω
RIN_TEMPCOInput termination linear temperature coefficient14.7mΩ/°C
CINSingle-ended input capacitanceSingle-channel mode at DC0.4pF
Dual-channel mode at DC0.4
TEMPERATURE DIODE CHARACTERISTICS (TDIODE+, TDIODE–)
ΔVBETemperature diode voltage slopeForced forward current of 100 µA; offset voltage (approximately 0.792 V at 0°C) varies with process and must be measured for each device; perform offset measurement with the device unpowered or with the PD pin asserted to minimize device self-heating; only assert the PD pin long enough to take the offset measurement–1.6mV/°C
BAND-GAP VOLTAGE OUTPUT (BG)
VBGReference output voltageIL ≤ 100 µA1.1V
VBG_DRIFTReference output temperature driftIL ≤ 100 µA–102µV/°C
CLOCK INPUTS (CLK+, CLK–, SYSREF+, SYSREF–, TMSTP+, TMSTP–)
ZTInternal terminationDifferential termination with DEVCLK_LVPECL_EN = 0, SYSREF_LVPECL_EN = 0, and TMSTP_LVPECL_EN = 0100Ω
Single-ended termination to GND (per pin) with DEVCLK_LVPECL_EN = 0, SYSREF_LVPECL_EN = 0, and TMSTP_LVPECL_EN = 050
VCMInput common-mode voltage, self-biasedSelf-biasing common-mode voltage for CLK± when AC-coupled (DEVCLK_LVPECL_EN must be set to 0)0.3V
Self-biasing common-mode voltage for SYSREF± when AC-coupled (SYSREF_LVPECL_EN must be set to 0) and with receiver enabled (SYSREF_RECV_EN = 1)0.3
Self-biasing common-mode voltage for SYSREF± when AC-coupled (SYSREF_LVPECL_EN must be set to 0) and with receiver disabled (SYSREF_RECV_EN = 0)VA11
CL_DIFFDifferential input capacitanceBetween positive and negative differential input pins0.1pF
CL_SESingle-ended input capacitanceEach input to ground0.5pF
SERDES OUTPUTS (DA[7:0]+, DA[7:0]–, DB[7:0]+, DB[7:0]–)
VODDifferential output voltage, peak-to-peak100-Ω load[1, 2, 3]550600650mVPP-DIFF
VCMOutput common-mode voltageAC-coupledVD11 / 2V
ZDIFFDifferential output impedance100Ω
CMOS INTERFACE (SCLK, SDI, SDO, SCS, PD, NCOA0, NCOA1, NCOB0, NCOB1, CALSTAT, CALTRIG, ORA0, ORA1, ORB0, ORB1, SYNCSE)
IIHHigh-level input current[1, 2, 3]40µA
IILLow-level input current[1, 2, 3]–40µA
CIInput capacitance2pF
VOHHigh-level output voltageILOAD = –400 µA[1, 2, 3]1.65V
VOLLow-level output voltageILOAD = 400 µA[1, 2, 3]150mV
(1) For subgroup definitions, please see Table 6-1.