SLVSDR2B November   2018  – March 2021 ADC12DJ3200QML-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC Specifications
    6. 6.6  Electrical Characteristics: Power Consumption
    7. 6.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 6.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagrams
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
        1. 7.3.1.1 Analog Input Protection
        2. 7.3.1.2 Full-Scale Voltage (VFS) Adjustment
        3. 7.3.1.3 Analog Input Offset Adjust
      2. 7.3.2 ADC Core
        1. 7.3.2.1 ADC Theory of Operation
        2. 7.3.2.2 ADC Core Calibration
        3. 7.3.2.3 ADC Overrange Detection
        4. 7.3.2.4 Code Error Rate (CER)
      3. 7.3.3 Timestamp
      4. 7.3.4 Clocking
        1. 7.3.4.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 7.3.4.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 7.3.4.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 7.3.4.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 7.3.4.3.2 Automatic SYSREF Calibration
      5. 7.3.5 Digital Down Converters (Dual-Channel Mode Only)
        1. 7.3.5.1 Numerically-Controlled Oscillator and Complex Mixer
          1. 7.3.5.1.1 NCO Fast Frequency Hopping (FFH)
          2. 7.3.5.1.2 NCO Selection
          3. 7.3.5.1.3 Basic NCO Frequency Setting Mode
          4. 7.3.5.1.4 Rational NCO Frequency Setting Mode
          5. 7.3.5.1.5 NCO Phase Offset Setting
          6. 7.3.5.1.6 NCO Phase Synchronization
        2. 7.3.5.2 Decimation Filters
        3. 7.3.5.3 Output Data Format
        4. 7.3.5.4 Decimation Settings
          1. 7.3.5.4.1 Decimation Factor
          2. 7.3.5.4.2 DDC Gain Boost
      6. 7.3.6 JESD204B Interface
        1. 7.3.6.1 Transport Layer
        2. 7.3.6.2 Scrambler
        3. 7.3.6.3 Link Layer
          1. 7.3.6.3.1 Code Group Synchronization (CGS)
          2. 7.3.6.3.2 Initial Lane Alignment Sequence (ILAS)
          3. 7.3.6.3.3 8b, 10b Encoding
          4. 7.3.6.3.4 Frame and Multiframe Monitoring
        4. 7.3.6.4 Physical Layer
          1. 7.3.6.4.1 SerDes Pre-Emphasis
        5. 7.3.6.5 JESD204B Enable
        6. 7.3.6.6 Multi-Device Synchronization and Deterministic Latency
        7. 7.3.6.7 Operation in Subclass 0 Systems
      7. 7.3.7 Alarm Monitoring
        1. 7.3.7.1 NCO Upset Detection
        2. 7.3.7.2 Clock Upset Detection
      8. 7.3.8 Temperature Monitoring Diode
      9. 7.3.9 Analog Reference Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Dual-Channel Mode
      2. 7.4.2 Single-Channel Mode (DES Mode)
      3. 7.4.3 JESD204B Modes
        1. 7.4.3.1 JESD204B Output Data Formats
        2. 7.4.3.2 Dual DDC and Redundant Data Mode
      4. 7.4.4 Power-Down Modes
      5. 7.4.5 Test Modes
        1. 7.4.5.1 Serializer Test-Mode Details
        2. 7.4.5.2 PRBS Test Modes
        3. 7.4.5.3 Ramp Test Mode
        4. 7.4.5.4 Short and Long Transport Test Mode
          1. 7.4.5.4.1 Short Transport Test Pattern
          2. 7.4.5.4.2 Long Transport Test Pattern
        5. 7.4.5.5 D21.5 Test Mode
        6. 7.4.5.6 K28.5 Test Mode
        7. 7.4.5.7 Repeated ILA Test Mode
        8. 7.4.5.8 Modified RPAT Test Mode
      6. 7.4.6 Calibration Modes and Trimming
        1. 7.4.6.1 Foreground Calibration Mode
        2. 7.4.6.2 Background Calibration Mode
        3. 7.4.6.3 Low-Power Background Calibration (LPBG) Mode
      7. 7.4.7 Offset Calibration
      8. 7.4.8 Trimming
      9. 7.4.9 Offset Filtering
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Streaming Mode
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
      2. 7.6.2 SYSREF Calibration Registers (0x2B0 to 0x2BF)
      3. 7.6.3 Alarm Registers (0x2C0 to 0x2C2)
  8. 8 Application Information Disclaimer
    1. 8.1 Application Information
      1. 8.1.1 Analog Inputs
      2. 8.1.2 Analog Input Bandwidth
      3. 8.1.3 Clocking
      4. 8.1.4 Radiation Environment Recommendations
        1. 8.1.4.1 Single Event Latch-Up (SEL)
        2. 8.1.4.2 Single Event Functional Interrupt (SEFI)
        3. 8.1.4.3 Single Event Upset (SEU)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 RF Input Signal Path
        2. 8.2.2.2 Calculating Values of AC-Coupling Capacitors
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZMX|196
  • NWE|196
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)ADC12DJ3200QML-SPUNIT
ZMX (CLGA)
NWE (CCGA)
196 PINS
RθJAJunction-to-ambient thermal resistance24.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance16.5°C/W
RθJBJunction-to-board thermal resistance10.5°C/W
ψJTJunction-to-top characterization parameter7.5°C/W
ψJBJunction-to-board characterization parameter10.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance6.5(2)°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The case bottom temperature was taken at the bottom of the solder columns on a fixed temperature PCB. This parameter only applies when solder columns are attached to the device.