SLVSGV1B June   2022  – March 2023 ADC12DJ5200-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC Specifications
    6. 6.6  Electrical Characteristics: Power Consumption
    7. 6.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 6.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Comparison
      2. 7.3.2  Analog Inputs
        1. 7.3.2.1 Analog Input Protection
        2. 7.3.2.2 Full-Scale Voltage (VFS) Adjustment
        3. 7.3.2.3 Analog Input Offset Adjust
      3. 7.3.3  ADC Core
        1. 7.3.3.1 ADC Theory of Operation
        2. 7.3.3.2 ADC Core Calibration
        3. 7.3.3.3 Analog Reference Voltage
        4. 7.3.3.4 ADC Over-range Detection
        5. 7.3.3.5 Code Error Rate (CER)
      4. 7.3.4  Temperature Monitoring Diode
      5. 7.3.5  Timestamp
      6. 7.3.6  Clocking
        1. 7.3.6.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 7.3.6.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 7.3.6.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 7.3.6.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 7.3.6.3.2 Automatic SYSREF Calibration
      7. 7.3.7  Programmable FIR Filter (PFIR)
        1. 7.3.7.1 Dual Channel Equalization
        2. 7.3.7.2 Single Channel Equalization
        3. 7.3.7.3 Time Varying Filter
      8. 7.3.8  Digital Down Converters (DDC)
        1. 7.3.8.1 Rounding and Saturation
        2. 7.3.8.2 Numerically-Controlled Oscillator and Complex Mixer
          1. 7.3.8.2.1 NCO Fast Frequency Hopping (FFH)
          2. 7.3.8.2.2 NCO Selection
          3. 7.3.8.2.3 Basic NCO Frequency Setting Mode
          4. 7.3.8.2.4 Rational NCO Frequency Setting Mode
          5. 7.3.8.2.5 NCO Phase Offset Setting
          6. 7.3.8.2.6 NCO Phase Synchronization
        3. 7.3.8.3 Decimation Filters
        4. 7.3.8.4 Output Data Format
        5. 7.3.8.5 Decimation Settings
          1. 7.3.8.5.1 Decimation Factor
          2. 7.3.8.5.2 DDC Gain Boost
      9. 7.3.9  JESD204C Interface
        1. 7.3.9.1 Transport Layer
        2. 7.3.9.2 Scrambler
        3. 7.3.9.3 Link Layer
        4. 7.3.9.4 8B/10B Link Layer
          1. 7.3.9.4.1 Data Encoding (8B/10B)
          2. 7.3.9.4.2 Multiframes and the Local Multiframe Clock (LMFC)
          3. 7.3.9.4.3 Code Group Synchronization (CGS)
          4. 7.3.9.4.4 Initial Lane Alignment Sequence (ILAS)
          5. 7.3.9.4.5 Frame and Multiframe Monitoring
        5. 7.3.9.5 64B/66B Link Layer
          1. 7.3.9.5.1 64B/66B Encoding
          2. 7.3.9.5.2 Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
          3. 7.3.9.5.3 Block, Multiblock and Extended Multiblock Alignment using Sync Header
            1. 7.3.9.5.3.1 Cyclic Redundancy Check (CRC) Mode
            2. 7.3.9.5.3.2 Forward Error Correction (FEC) Mode
          4. 7.3.9.5.4 Initial Lane Alignment
          5. 7.3.9.5.5 Block, Multiblock and Extended Multiblock Alignment Monitoring
        6. 7.3.9.6 Physical Layer
          1. 7.3.9.6.1 SerDes Pre-Emphasis
        7. 7.3.9.7 JESD204C Enable
        8. 7.3.9.8 Multi-Device Synchronization and Deterministic Latency
        9. 7.3.9.9 Operation in Subclass 0 Systems
      10. 7.3.10 Alarm Monitoring
        1. 7.3.10.1 Clock Upset Detection
        2. 7.3.10.2 FIFO Upset Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Dual-Channel Mode
      2. 7.4.2 Single-Channel Mode (DES Mode)
      3. 7.4.3 Dual-Input Single-Channel Mode (DUAL DES Mode)
      4. 7.4.4 JESD204C Modes
        1. 7.4.4.1 JESD204C Operating Modes Table
        2. 7.4.4.2 JESD204C Modes continued
        3. 7.4.4.3 JESD204C Transport Layer Data Formats
        4. 7.4.4.4 64B/66B Sync Header Stream Configuration
      5. 7.4.5 Power-Down Modes
      6. 7.4.6 Test Modes
        1. 7.4.6.1 Serializer Test-Mode Details
        2. 7.4.6.2 PRBS Test Modes
        3. 7.4.6.3 Clock Pattern Mode
        4. 7.4.6.4 Ramp Test Mode
        5. 7.4.6.5 Short and Long Transport Test Mode
          1. 7.4.6.5.1 Short Transport Test Pattern
        6. 7.4.6.6 D21.5 Test Mode
        7. 7.4.6.7 K28.5 Test Mode
        8. 7.4.6.8 Repeated ILA Test Mode
        9. 7.4.6.9 Modified RPAT Test Mode
      7. 7.4.7 Calibration Modes and Trimming
        1. 7.4.7.1 Foreground Calibration Mode
        2. 7.4.7.2 Background Calibration Mode
        3. 7.4.7.3 Low-Power Background Calibration (LPBG) Mode
      8. 7.4.8 Offset Calibration
      9. 7.4.9 Trimming
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Streaming Mode
    6. 7.6 SPI Register Map
  8. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband RF Sampling Receiver
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input Signal Path
          2. 8.2.1.1.2 Clocking
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Calculating Values of AC-Coupling Capacitors
      2. 8.2.2 Reconfigurable Dual-Channel 5-GSPS or Single-Channel 10-Gsps Oscilloscope
        1. 8.2.2.1 Design Requirements
          1. 8.2.2.1.1 Input Signal Path
          2. 8.2.2.1.2 Clocking
          3. 8.2.2.1.3 ADC12DJ5200-SP
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Power Sequencing
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 143
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.9.1 Transport Layer

The transport layer takes samples from the ADC output and maps the samples into octets inside of frames. The transport layer is common to both 8B/10B and 64B/66B encoding modes. These frames are then mapped onto the available lanes. The mapping of octets into frames and frames onto lanes is defined by the transport layer settings such as L, M, F, S, N and N'. An octet is 8 bits (before 8B/10B or 64B/66B encoding), a frame consists of F octets and the frames are mapped onto L lanes. Samples are N bits, but sent as N' bits across the link. The samples come from M converters and there are S samples per converter per frame cycle. M is sometimes artificially increased in order to obtain a more desirable mapping, for instance lower latency may be achieved with a larger M value for long frames.

There are a number of predefined transport layer modes in the device that are defined in Operating Modes . The high level configuration parameters for the transport layer in the device are described in Table 7-21. The transport layer mode is chosen by simply setting the JMODE register setting. For reference, the various configuration parameters for JESD204C are defined in Table 7-22.

The link layer further maps the frames into multiframes when using 8B/10B encoding or blocks, multiblocks and extended multiblocks when using 64B/66B encoding.