SLVSEN9F April   2019  – June 2024 ADC12DJ5200RF

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: DC Specifications
    6. 5.6  Electrical Characteristics: Power Consumption
    7. 5.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 5.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 5.9  Timing Requirements
    10. 5.10 Switching Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Comparison
      2. 6.3.2  Analog Inputs
        1. 6.3.2.1 Analog Input Protection
        2. 6.3.2.2 Full-Scale Voltage (VFS) Adjustment
        3. 6.3.2.3 Analog Input Offset Adjust
      3. 6.3.3  ADC Core
        1. 6.3.3.1 ADC Theory of Operation
        2. 6.3.3.2 ADC Core Calibration
        3. 6.3.3.3 Analog Reference Voltage
        4. 6.3.3.4 ADC Overrange Detection
        5. 6.3.3.5 Code Error Rate (CER)
      4. 6.3.4  Temperature Monitoring Diode
      5. 6.3.5  Timestamp
      6. 6.3.6  Clocking
        1. 6.3.6.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 6.3.6.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 6.3.6.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 6.3.6.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 6.3.6.3.2 Automatic SYSREF Calibration
      7. 6.3.7  Programmable FIR Filter (PFIR)
        1. 6.3.7.1 Dual Channel Equalization
        2. 6.3.7.2 Single Channel Equalization
        3. 6.3.7.3 Time Varying Filter
      8. 6.3.8  Digital Down Converters (DDC)
        1. 6.3.8.1 Rounding and Saturation
        2. 6.3.8.2 Numerically-Controlled Oscillator and Complex Mixer
          1. 6.3.8.2.1 NCO Fast Frequency Hopping (FFH)
          2. 6.3.8.2.2 NCO Selection
          3. 6.3.8.2.3 Basic NCO Frequency Setting Mode
          4. 6.3.8.2.4 Rational NCO Frequency Setting Mode
          5. 6.3.8.2.5 NCO Phase Offset Setting
          6. 6.3.8.2.6 NCO Phase Synchronization
        3. 6.3.8.3 Decimation Filters
        4. 6.3.8.4 Output Data Format
        5. 6.3.8.5 Decimation Settings
          1. 6.3.8.5.1 Decimation Factor
          2. 6.3.8.5.2 DDC Gain Boost
      9. 6.3.9  JESD204C Interface
        1. 6.3.9.1 Transport Layer
        2. 6.3.9.2 Scrambler
        3. 6.3.9.3 Link Layer
        4. 6.3.9.4 8B/10B Link Layer
          1. 6.3.9.4.1 Data Encoding (8B/10B)
          2. 6.3.9.4.2 Multiframes and the Local Multiframe Clock (LMFC)
          3. 6.3.9.4.3 Code Group Synchronization (CGS)
          4. 6.3.9.4.4 Initial Lane Alignment Sequence (ILAS)
          5. 6.3.9.4.5 Frame and Multiframe Monitoring
        5. 6.3.9.5 64B/66B Link Layer
          1. 6.3.9.5.1 64B/66B Encoding
          2. 6.3.9.5.2 Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
          3. 6.3.9.5.3 Block, Multiblock and Extended Multiblock Alignment using Sync Header
            1. 6.3.9.5.3.1 Cyclic Redundancy Check (CRC) Mode
            2. 6.3.9.5.3.2 Forward Error Correction (FEC) Mode
          4. 6.3.9.5.4 Initial Lane Alignment
          5. 6.3.9.5.5 Block, Multiblock and Extended Multiblock Alignment Monitoring
        6. 6.3.9.6 Physical Layer
          1. 6.3.9.6.1 SerDes Pre-Emphasis
        7. 6.3.9.7 JESD204C Enable
        8. 6.3.9.8 Multi-Device Synchronization and Deterministic Latency
        9. 6.3.9.9 Operation in Subclass 0 Systems
      10. 6.3.10 Alarm Monitoring
        1. 6.3.10.1 Clock Upset Detection
        2. 6.3.10.2 FIFO Upset Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Dual-Channel Mode
      2. 6.4.2 Single-Channel Mode (DES Mode)
      3. 6.4.3 Dual-Input Single-Channel Mode (DUAL DES Mode)
      4. 6.4.4 JESD204C Modes
        1. 6.4.4.1 JESD204C Operating Modes Table
        2. 6.4.4.2 JESD204C Modes continued
        3. 6.4.4.3 JESD204C Transport Layer Data Formats
        4. 6.4.4.4 64B/66B Sync Header Stream Configuration
        5. 6.4.4.5 Dual DDC and Redundant Data Mode
      5. 6.4.5 Power-Down Modes
      6. 6.4.6 Test Modes
        1. 6.4.6.1 Serializer Test-Mode Details
        2. 6.4.6.2 PRBS Test Modes
        3. 6.4.6.3 Clock Pattern Mode
        4. 6.4.6.4 Ramp Test Mode
        5. 6.4.6.5 Short and Long Transport Test Mode
          1. 6.4.6.5.1 Short Transport Test Pattern
        6. 6.4.6.6 D21.5 Test Mode
        7. 6.4.6.7 K28.5 Test Mode
        8. 6.4.6.8 Repeated ILA Test Mode
        9. 6.4.6.9 Modified RPAT Test Mode
      7. 6.4.7 Calibration Modes and Trimming
        1. 6.4.7.1 Foreground Calibration Mode
        2. 6.4.7.2 Background Calibration Mode
        3. 6.4.7.3 Low-Power Background Calibration (LPBG) Mode
      8. 6.4.8 Offset Calibration
      9. 6.4.9 Trimming
    5. 6.5 Programming
      1. 6.5.1 Using the Serial Interface
        1. 6.5.1.1 SCS
        2. 6.5.1.2 SCLK
        3. 6.5.1.3 SDI
        4. 6.5.1.4 SDO
        5. 6.5.1.5 Streaming Mode
    6. 6.6 SPI Register Map
  8. 7 Application Information Disclaimer
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Wideband RF Sampling Receiver
        1. 7.2.1.1 Design Requirements
          1. 7.2.1.1.1 Input Signal Path
          2. 7.2.1.1.2 Clocking
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Calculating Values of AC-Coupling Capacitors
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Reconfigurable Dual-Channel 5-GSPS or Single-Channel 10-Gsps Oscilloscope
        1. 7.2.2.1 Design Requirements
          1. 7.2.2.1.1 Input Signal Path
          2. 7.2.2.1.2 Clocking
          3. 7.2.2.1.3 ADC12DJ5200RF Ososcilloscope Applications
        2. 7.2.2.2 Application Curves
    3. 7.3 Initialization Set Up
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 Power Sequencing
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD Supply voltage range VA19(2) –0.3 2.35 V
VA11(2) –0.3 1.32
VD11(3) –0.3 1.32
Voltage between VD11 and VA11 –1.32 1.32
VGND Voltage between AGND and DGND –0.1 0.1 V
VPIN Pin voltage range DA[7:0]+, DA[7:0]–, DB[7:0]+, DB[7:0]–, TMSTP+, TMSTP–(3) –0.5 VD11 + 0.5(5) V
CLK+, CLK–, SYSREF+, SYSREF–(2) –0.5 VA11 + 0.5(4)
BG, TDIODE+, TDIODE–(2) –0.5 VA19 + 0.5(6)
INA+, INA–, INB+, INB–(2) –1 1
CALSTAT, CALTRIG, NCOA0, NCOA1, NCOB0, NCOB1, ORA0, ORA1, ORB0, ORB1, PD, SCLK, SCS, SDI, SDO, SYNCSE(2) –0.5 VA19 + 0.5(6)
IMAX(ANY) Peak input current (any input except INA+, INA–, INB+, INB–) –25 25 mA
IMAX(INx) Peak input current (INA+, INA–, INB+, INB–) –50 50 mA
PMAX(INx) Peak RF input power (INA+, INA–, INB+, INB–) differential with ZS-DIFF = 100 Ω, up to 21 days(7) 26.5 dBm
Single-ended with ZS-SE = 50 Ω 16.4 dBm
IMAX(ALL) Peak total input current (sum of absolute value of all currents forced in or out, not including power-supply current) 100 mA
Tj Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured to AGND.
(3) Measured to DGND.
(4) Maximum voltage not to exceed VA11 absolute maximum rating.
(5) Maximum voltage not to exceed VD11 absolute maximum rating.
(6) Maximum voltage not to exceed VA19 absolute maximum rating.
(7) Tested continuously for 21 days with FIN = 1.2GHz on a typical device. At the end of testing, the device was not damaged. During the overdrive, the ADC is still properly converting the input signal, although it will be saturated for voltages beyond the input fullscale.