SBAS670B July   2014  – April 2017 ADC3441 , ADC3442 , ADC3443 , ADC3444

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: General
    6. 7.6  Electrical Characteristics: ADC3441, ADC3442
    7. 7.7  Electrical Characteristics: ADC3443, ADC3444
    8. 7.8  AC Performance: ADC3441
    9. 7.9  AC Performance: ADC3442
    10. 7.10 AC Performance: ADC3443
    11. 7.11 AC Performance: ADC3444
    12. 7.12 Digital Characteristics
    13. 7.13 Timing Requirements: General
    14. 7.14 Timing Requirements: LVDS Output
    15. 7.15 Typical Characteristics: ADC3441
    16. 7.16 Typical Characteristics: ADC3442
    17. 7.17 Typical Characteristics: ADC3443
    18. 7.18 Typical Characteristics: ADC3444
    19. 7.19 Typical Characteristics: Common
    20. 7.20 Typical Characteristics: Contour
  8. 8 Parameter Measurement Information
    1. 8.1 Timing Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Inputs
      2. 9.3.2 Clock Input
        1. 9.3.2.1 Using the SYSREF Input
        2. 9.3.2.2 SNR and Clock Jitter
      3. 9.3.3 Digital Output Interface
        1. 9.3.3.1 One-Wire Interface: 14x Serialization
        2. 9.3.3.2 Two-Wire Interface: 7x Serialization
    4. 9.4 Device Functional Modes
      1. 9.4.1 Input Clock Divider
      2. 9.4.2 Chopper Functionality
      3. 9.4.3 Power-Down Control
      4. 9.4.4 Internal Dither Algorithm
      5. 9.4.5 Summary of Performance Mode Registers
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Register Initialization
          1. 9.5.1.1.1 Serial Register Write
          2. 9.5.1.1.2 Serial Register Readout
      2. 9.5.2 ADC3441 Power-Up Requirements
    6. 9.6 Register Maps
      1. 9.6.1 Serial Register Description
        1. 9.6.1.1  Register 01h (address = 01h)
        2. 9.6.1.2  Register 03h (address = 03h)
        3. 9.6.1.3  Register 04h (address = 04h)
        4. 9.6.1.4  Register 05h (address = 05h)
        5. 9.6.1.5  Register 06h (address = 06h)
        6. 9.6.1.6  Register 07h (address = 07h)
        7. 9.6.1.7  Register 09h (address = 09h)
        8. 9.6.1.8  Register 0Ah (address = 0Ah)
        9. 9.6.1.9  Register 0Bh (address = 0Bh)
        10. 9.6.1.10 Register 13h (address = 13h)
        11. 9.6.1.11 Register 0Eh (address = 0Eh)
        12. 9.6.1.12 Register 0Fh (address = 0Fh)
        13. 9.6.1.13 Register 15h (address = 15h)
        14. 9.6.1.14 Register 25h (address = 25h)
        15. 9.6.1.15 Register 27h (address = 27h)
        16. 9.6.1.16 Register 11Dh (address = 11Dh)
        17. 9.6.1.17 Register 122h (address = 122h)
        18. 9.6.1.18 Register 134h (address = 134h)
        19. 9.6.1.19 Register 139h (address = 139h)
        20. 9.6.1.20 Register 21Dh (address = 21Dh)
        21. 9.6.1.21 Register 222h (address = 222h)
        22. 9.6.1.22 Register 234h (address = 234h)
        23. 9.6.1.23 Register 239h (address = 239h)
        24. 9.6.1.24 Register 308h (address = 308h)
        25. 9.6.1.25 Register 41Dh (address = 41Dh)
        26. 9.6.1.26 Register 422h (address = 422h)
        27. 9.6.1.27 Register 434h (address = 434h)
        28. 9.6.1.28 Register 439h (address = 439h)
        29. 9.6.1.29 Register 51Dh (address = 51Dh)
        30. 9.6.1.30 Register 522h (address = 522h)
        31. 9.6.1.31 Register 534h (address = 534h)
        32. 9.6.1.32 Register 539h (address = 539h)
        33. 9.6.1.33 Register 608h (address = 608h)
        34. 9.6.1.34 Register 70Ah (address = 70Ah)
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Driving Circuit Design: Low Input Frequencies
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Driving Circuit Design: Input Frequencies Between 100 MHz to 230 MHz
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Driving Circuit Design: Input Frequencies Greater than 230 MHz
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now.

Table 45. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
ADC3441 Click here Click here Click here Click here Click here
ADC3442 Click here Click here Click here Click here Click here
ADC3443 Click here Click here Click here Click here Click here
ADC3444 Click here Click here Click here Click here Click here

13.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.