SBAS669A May   2014  – January 2015 ADC34J22 , ADC34J23 , ADC34J24 , ADC34J25

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Summary of Special Mode Registers
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics: ADC34J24, ADC34J25
    7. 7.7  Electrical Characteristics: ADC34J22, ADC34J23
    8. 7.8  Electrical Characteristics: General
    9. 7.9  AC Performance: ADC34J25
    10. 7.10 AC Performance: ADC34J24
    11. 7.11 AC Performance: ADC34J23
    12. 7.12 AC Performance: ADC34J22
    13. 7.13 Digital Characteristics
    14. 7.14 Timing Characteristics
    15. 7.15 Typical Characteristics: ADC34J25
    16. 7.16 Typical Characteristics: ADC34J24
    17. 7.17 Typical Characteristics: ADC34J23
    18. 7.18 Typical Characteristics: ADC34J22
    19. 7.19 Typical Characteristics: Common Plots
    20. 7.20 Typical Characteristics: Contour Plots
  8. 8 Parameter Measurement Information
    1. 8.1 Timing Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Inputs
      2. 9.3.2 Clock Input
        1. 9.3.2.1 SNR and Clock Jitter
        2. 9.3.2.2 Input Clock Divider
      3. 9.3.3 Power-Down Control
      4. 9.3.4 Internal Dither Algorithm
      5. 9.3.5 JESD204B Interface
        1. 9.3.5.1 JESD204B Initial Lane Alignment (ILA)
        2. 9.3.5.2 JESD204B Test Patterns
        3. 9.3.5.3 JESD204B Frame Assembly
        4. 9.3.5.4 Digital Outputs
    4. 9.4 Device Functional Modes
      1. 9.4.1 Digital Gain
      2. 9.4.2 Overrange Indication
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Register Initialization
          1. 9.5.1.1.1 Serial Register Write
          2. 9.5.1.1.2 Serial Register Readout
      2. 9.5.2 Register Initialization
      3. 9.5.3 Start-Up Sequence
    6. 9.6 Register Map
      1. 9.6.1 Serial Register Description
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Driving Circuit Design: Low Input Frequencies
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Driving Circuit Design: Input Frequencies Between 100 MHz to 230 MHz
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Driving Circuit Design: Input Frequencies Greater than 230 MHz
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Related Links

Table 48 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 48. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
ADC34J22 Click here Click here Click here Click here Click here
ADC34J23 Click here Click here Click here Click here Click here
ADC34J24 Click here Click here Click here Click here Click here
ADC34J25 Click here Click here Click here Click here Click here

13.2 Trademarks

PowerPAD is a trademark of Texas Instruments, Inc.

All other trademarks are the property of their respective owners.

13.3 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.