SBAS669A May   2014  – January 2015 ADC34J22 , ADC34J23 , ADC34J24 , ADC34J25

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Summary of Special Mode Registers
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics: ADC34J24, ADC34J25
    7. 7.7  Electrical Characteristics: ADC34J22, ADC34J23
    8. 7.8  Electrical Characteristics: General
    9. 7.9  AC Performance: ADC34J25
    10. 7.10 AC Performance: ADC34J24
    11. 7.11 AC Performance: ADC34J23
    12. 7.12 AC Performance: ADC34J22
    13. 7.13 Digital Characteristics
    14. 7.14 Timing Characteristics
    15. 7.15 Typical Characteristics: ADC34J25
    16. 7.16 Typical Characteristics: ADC34J24
    17. 7.17 Typical Characteristics: ADC34J23
    18. 7.18 Typical Characteristics: ADC34J22
    19. 7.19 Typical Characteristics: Common Plots
    20. 7.20 Typical Characteristics: Contour Plots
  8. 8 Parameter Measurement Information
    1. 8.1 Timing Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Inputs
      2. 9.3.2 Clock Input
        1. 9.3.2.1 SNR and Clock Jitter
        2. 9.3.2.2 Input Clock Divider
      3. 9.3.3 Power-Down Control
      4. 9.3.4 Internal Dither Algorithm
      5. 9.3.5 JESD204B Interface
        1. 9.3.5.1 JESD204B Initial Lane Alignment (ILA)
        2. 9.3.5.2 JESD204B Test Patterns
        3. 9.3.5.3 JESD204B Frame Assembly
        4. 9.3.5.4 Digital Outputs
    4. 9.4 Device Functional Modes
      1. 9.4.1 Digital Gain
      2. 9.4.2 Overrange Indication
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Register Initialization
          1. 9.5.1.1.1 Serial Register Write
          2. 9.5.1.1.2 Serial Register Readout
      2. 9.5.2 Register Initialization
      3. 9.5.3 Start-Up Sequence
    6. 9.6 Register Map
      1. 9.6.1 Serial Register Description
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Driving Circuit Design: Low Input Frequencies
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Driving Circuit Design: Input Frequencies Between 100 MHz to 230 MHz
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Driving Circuit Design: Input Frequencies Greater than 230 MHz
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Layout

12.1 Layout Guidelines

The ADC34J2x EVM layout can be used as a reference layout to obtain the best performance. A layout diagram of the EVM top layer is provided in Figure 208. Some important points to remember while laying out the board are:

  1. Analog inputs are located on opposite sides of the device pin out to ensure minimum crosstalk on the package level. To minimize crosstalk onboard, the analog inputs should exit the pin out in opposite directions, as shown in the reference layout of Figure 208 as much as possible.
  2. In the device pin out, the sampling clock is located on a side perpendicular to the analog inputs in order to minimize coupling between them. This configuration is also maintained on the reference layout of Figure 208 as much as possible.
  3. Digital outputs should be kept away from the analog inputs. When these digital outputs exit the pin out, the digital output traces should not be kept parallel to the analog input traces because this configuration may result in coupling from digital outputs to analog inputs and degrade performance. All digital output traces to the receiver [such as a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC)] should be matched in length to avoid skew among outputs.
  4. At each power-supply pin (AVDD and DVDD), a 0.1-µF decoupling capacitor should be kept close to the device. A separate decoupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF capacitors can be kept close to the supply source.

12.2 Layout Example

Lyt_BAS663.gifFigure 208. Typical Layout of the ADC34J2x Board