SBASAL3 September   2024 ADC3669

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - Power Consumption
    6. 5.6  Electrical Characteristics - DC Specifications
    7. 5.7  Electrical Characteristics - AC Specifications (ADC3668 - 250 MSPS)
    8. 5.8  Electrical Characteristics - AC Specifications (ADC3669 - 500 MSPS)
    9. 5.9  Timing Requirements
    10. 5.10 Typical Characteristics, ADC3668
    11. 5.11 Typical Characteristics, ADC3669
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
        1. 7.3.1.1 Nyquist Zone Selection
        2. 7.3.1.2 Analog Front End Design
      2. 7.3.2 Sampling Clock Input
      3. 7.3.3 Multi-Chip Synchronization
        1. 7.3.3.1 SYSREF Monitor
      4. 7.3.4 Time-Stamp
      5. 7.3.5 Overrange
      6. 7.3.6 External Voltage Reference
      7. 7.3.7 Digital Gain
      8. 7.3.8 Decimation Filter
        1. 7.3.8.1 Uncommon Decimation Ratios
        2. 7.3.8.2 Decimation Filter Response
        3. 7.3.8.3 Decimation Filter Configuration
        4. 7.3.8.4 Numerically Controlled Oscillator (NCO)
      9. 7.3.9 Digital Interface
        1. 7.3.9.1 Parallel LVDS (DDR)
        2. 7.3.9.2 Serial LVDS (SLVDS) with Decimation
        3. 7.3.9.3 Output Data Format
        4. 7.3.9.4 32-bit Output Resolution
        5. 7.3.9.5 Output MUX
        6. 7.3.9.6 Test Pattern
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Latency Mode
      2. 7.4.2 Digital Channel Averaging
      3. 7.4.3 Power Down Mode
    5. 7.5 Programming
      1. 7.5.1 GPIO Programming
      2. 7.5.2 Register Write
      3. 7.5.3 Register Read
      4. 7.5.4 Device Programming
      5. 7.5.5 Register Map
      6. 7.5.6 Detailed Register Description
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Wideband Spectrum Analyzer
      2. 8.2.2 Design Requirements
        1. 8.2.2.1 Input Signal Path
        2. 8.2.2.2 Clocking
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Sampling Clock
      4. 8.2.4 Application Performance Plots
      5. 8.2.5 Initialization Set Up
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Input Signal Path

Appropriate band limiting filters must be used to reject unwanted frequencies in the receive signal path.

A 1:2 (for 100Ω effective termination impedance) or a 1:1 (for 50Ω effective termination impedance) balun transformer is needed to convert the single ended RF input to differential for input to the ADC. The balun outputs must be AC coupled with 100pF capacitors. A back-to-back balun configuration often times gives better SFDR performance. Table 8-1 lists a number of recommended baluns for different impedance ratios and frequency ranges.

The S-parameters of the ADC input can be used to design the front end matching network.

Table 8-1 Recommended Baluns
PART NUMBER MANURACTURER(1) IMPEDANCE RATIO AMPLITUDE BALANCE (dB) PHASE BALANCE (°) FREQUENCY RANGE
BAL-0009SMG Marki Microwave 1:2 0.6 5 0.5MHz to 9GHz
TCM2-43X+ Minicircuits 1:2 0.5 7 10MHz to 4GHz
TCM2-33WX+ Minicircuits 1:2 0.7 4 10MHz to 3GHz
TC1-1-13M+ Minicircuits 1:1 0.5 2-3 10MHz to 3GHz