SBASAB5A March   2024  – December 2024 ADC3683-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - Power Consumption
    6. 5.6 Electrical Characteristics - DC Specifications
    7. 5.7 Electrical Characteristics - AC Specifications
    8. 5.8 Timing Requirements
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
        1. 7.3.1.1 Analog Input Bandwidth
        2. 7.3.1.2 Analog Front End Design
          1. 7.3.1.2.1 Sampling Glitch Filter
          2. 7.3.1.2.2 AC Coupling
          3. 7.3.1.2.3 DC Coupling
      2. 7.3.2 Clock Input
        1. 7.3.2.1 Differential Vs Single-ended Clock Input
        2. 7.3.2.2 Signal Acquisition Time Adjust
      3. 7.3.3 Voltage Reference
        1. 7.3.3.1 Internal Voltage Reference
        2. 7.3.3.2 External Voltage Reference
      4. 7.3.4 Digital Data Path & Interface
        1. 7.3.4.1 Data Path Overview
        2. 7.3.4.2 Digital Interface
        3. 7.3.4.3 DCLKIN
        4. 7.3.4.4 Output Scrambler
        5. 7.3.4.5 Output Bit Mapper
          1. 7.3.4.5.1 2-Wire Mode
          2. 7.3.4.5.2 1-Wire Mode
          3. 7.3.4.5.3 1/2-Wire Mode
        6. 7.3.4.6 Output Data Format
        7. 7.3.4.7 Test Pattern
      5. 7.3.5 Digital Down Converter
        1. 7.3.5.1 Decimation Operation
        2. 7.3.5.2 Numerically Controlled Oscillator (NCO)
        3. 7.3.5.3 Decimation Filters
        4. 7.3.5.4 SYNC
        5. 7.3.5.5 Output Data Format with Decimation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Latency Mode
      2. 7.4.2 Averaging Mode
    5. 7.5 Programming
      1. 7.5.1 Pin Control
      2. 7.5.2 Serial Peripheral Interface (SPI)
        1. 7.5.2.1 Register Write
        2. 7.5.2.2 Register Read
      3. 7.5.3 Device Configuration Steps
      4. 7.5.4 Register Map
        1. 7.5.4.1 Detailed Register Description
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HBP|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.4.7 Test Pattern

Figure 7-10 shows the location of the test pattern blocks within the device. When the digital signal processing (DSP) features are disabled (D2 of 0x24), a test pattern block can be enabled to replace the ADC data. Similarly, when using the DDC, a test pattern is available to replace the DDC data.

Note: No test pattern block is available when the DSP features are enabled and the DDC is not used.

Each test pattern block has the capability to generate one of the following outputs:

  • Ramp pattern with programmable step size set by PAT_DATA.
  • Constant pattern with a programmable custom pattern set by PAT_DATA.
As shown in Figure 7-10, there are two test pattern blocks, test pattern 0 and test pattern 1. The test pattern mode for each block can be configured via D7:D5 and D4:D2 of 0x16. A shared set of data bits (PAT_DATA) is given to the test pattern blocks and this data is used as ramp pattern step size and/or the constant pattern. The PAT_DATA is an 18-bit value located across three different registers: D17:D16 in 0x16, D15:D8 in 0x15, and D7:D0 in 0x14. The PAT_DATA is MSB aligned. For example, if the device is configured for 14-bit resolution and constant pattern, only the top 14-bits of the PAT_DATA are used for the constant pattern. Additionally, in ramp mode, the test pattern counter operates at a 18-bit resolution; therefore, the ramp pattern step size must be configured based on the desired resolution and the step size at that resolution.

  • The test pattern data must be configured to the following for a step size of one at each resolution:
    • 0x00001: 18-bit output resolution
    • 0x00004: 16-bit output resolution
    • 0x00010: 14-bit output resolution