SBASAB5A March   2024  – December 2024 ADC3683-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - Power Consumption
    6. 5.6 Electrical Characteristics - DC Specifications
    7. 5.7 Electrical Characteristics - AC Specifications
    8. 5.8 Timing Requirements
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
        1. 7.3.1.1 Analog Input Bandwidth
        2. 7.3.1.2 Analog Front End Design
          1. 7.3.1.2.1 Sampling Glitch Filter
          2. 7.3.1.2.2 AC Coupling
          3. 7.3.1.2.3 DC Coupling
      2. 7.3.2 Clock Input
        1. 7.3.2.1 Differential Vs Single-ended Clock Input
        2. 7.3.2.2 Signal Acquisition Time Adjust
      3. 7.3.3 Voltage Reference
        1. 7.3.3.1 Internal Voltage Reference
        2. 7.3.3.2 External Voltage Reference
      4. 7.3.4 Digital Data Path & Interface
        1. 7.3.4.1 Data Path Overview
        2. 7.3.4.2 Digital Interface
        3. 7.3.4.3 DCLKIN
        4. 7.3.4.4 Output Scrambler
        5. 7.3.4.5 Output Bit Mapper
          1. 7.3.4.5.1 2-Wire Mode
          2. 7.3.4.5.2 1-Wire Mode
          3. 7.3.4.5.3 1/2-Wire Mode
        6. 7.3.4.6 Output Data Format
        7. 7.3.4.7 Test Pattern
      5. 7.3.5 Digital Down Converter
        1. 7.3.5.1 Decimation Operation
        2. 7.3.5.2 Numerically Controlled Oscillator (NCO)
        3. 7.3.5.3 Decimation Filters
        4. 7.3.5.4 SYNC
        5. 7.3.5.5 Output Data Format with Decimation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Latency Mode
      2. 7.4.2 Averaging Mode
    5. 7.5 Programming
      1. 7.5.1 Pin Control
      2. 7.5.2 Serial Peripheral Interface (SPI)
        1. 7.5.2.1 Register Write
        2. 7.5.2.2 Register Read
      3. 7.5.3 Device Configuration Steps
      4. 7.5.4 Register Map
        1. 7.5.4.1 Detailed Register Description
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HBP|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5.2 Layout Example

The following is an example showing the top layer layout of the ADC3683-SP on the ADC3683-SP EVM.

  • Signal and clock inputs are routed as differential signals on the top layer.
  • LVDS lanes go through vias to the bottom layer to minimize coupling on the analog inputs.
ADC3683-SP Layout Example for the ADC3683-SP EVM Figure 8-4 Layout Example for the ADC3683-SP EVM