SBASAB5A March   2024  – December 2024 ADC3683-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - Power Consumption
    6. 5.6 Electrical Characteristics - DC Specifications
    7. 5.7 Electrical Characteristics - AC Specifications
    8. 5.8 Timing Requirements
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
        1. 7.3.1.1 Analog Input Bandwidth
        2. 7.3.1.2 Analog Front End Design
          1. 7.3.1.2.1 Sampling Glitch Filter
          2. 7.3.1.2.2 AC Coupling
          3. 7.3.1.2.3 DC Coupling
      2. 7.3.2 Clock Input
        1. 7.3.2.1 Differential Vs Single-ended Clock Input
        2. 7.3.2.2 Signal Acquisition Time Adjust
      3. 7.3.3 Voltage Reference
        1. 7.3.3.1 Internal Voltage Reference
        2. 7.3.3.2 External Voltage Reference
      4. 7.3.4 Digital Data Path & Interface
        1. 7.3.4.1 Data Path Overview
        2. 7.3.4.2 Digital Interface
        3. 7.3.4.3 DCLKIN
        4. 7.3.4.4 Output Scrambler
        5. 7.3.4.5 Output Bit Mapper
          1. 7.3.4.5.1 2-Wire Mode
          2. 7.3.4.5.2 1-Wire Mode
          3. 7.3.4.5.3 1/2-Wire Mode
        6. 7.3.4.6 Output Data Format
        7. 7.3.4.7 Test Pattern
      5. 7.3.5 Digital Down Converter
        1. 7.3.5.1 Decimation Operation
        2. 7.3.5.2 Numerically Controlled Oscillator (NCO)
        3. 7.3.5.3 Decimation Filters
        4. 7.3.5.4 SYNC
        5. 7.3.5.5 Output Data Format with Decimation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Latency Mode
      2. 7.4.2 Averaging Mode
    5. 7.5 Programming
      1. 7.5.1 Pin Control
      2. 7.5.2 Serial Peripheral Interface (SPI)
        1. 7.5.2.1 Register Write
        2. 7.5.2.2 Register Read
      3. 7.5.3 Device Configuration Steps
      4. 7.5.4 Register Map
        1. 7.5.4.1 Detailed Register Description
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HBP|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics - Power Consumption

Typical values are at TA = 25°C, full temperature range is TMIN = -55°C to TMAX = 105°C, ADC sampling rate = 65MSPS, 50% clock duty cycle, AVDD = IOVDD = 1.8V, external 1.6V reference, and –1dBFS differential input, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ADC3683-SP: 65MSPS
IAVDD Analog supply current Internal reference 69 mA
External reference 63 83.5
IIOVDD I/O supply current 2-wire 41 48.5
PDIS Power dissipation External reference, 2-wire 187 232 mW
IIOVDD I/O supply current 2-wire, 1/2-swing 34 mA
4x real decimation, 1-wire 46
4x real decimation, 1/2-wire 47
16x real decimation, 1-wire 43
16x real decimation, 1/2-wire 43
4x complex decimation, 1-wire 48
16x complex decimation, 1-wire 43
16x complex decimation, 1/2-wire 44
PDIS Power consumption in global power down mode Default mask settings, internal reference 8 mW
Default mask settings, external reference 10