SBASAB5 March 2024 ADC3683-SP
PRODMIX
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | ADC3683-SP | UNIT | |
---|---|---|---|
HBP (CFP) | |||
64 Pins | |||
RΘJA | Junction-to-ambient thermal resistance | 28.4 | °C/W |
RΘJC(top) | Junction-to-case (top) thermal resistance | 12.0 | °C/W |
RΘJB | Junction-to-board thermal resistance | 14.1 | °C/W |
ΨJT | Junction-to-top characterization parameter | 7.8 | °C/W |
ΨJB | Junction-to-board characterization parameter | 13.8 | °C/W |
RΘJC(bot) | Junction-to-case (bottom) thermal resistance | 7.0 | °C/W |