SBASAD1A December   2023  – May 2024 ADC3910D025 , ADC3910D065 , ADC3910D125 , ADC3910S025 , ADC3910S065 , ADC3910S125

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - Power Consumption
    6. 5.6  Electrical Characteristics - DC Specifications
    7. 5.7  Electrical Characteristics - AC Specifications (25 MSPS)
    8. 5.8  Electrical Characteristics - AC Specifications (65 MSPS)
    9. 5.9  Electrical Characteristics - AC Specifications (125 MSPS)
    10. 5.10 Timing Requirements
    11. 5.11 Output Interface Timing Diagram
    12. 5.12 Typical Characteristics - 25MSPS
    13. 5.13 Typical Characteristics - 65MSPS
    14. 5.14 Typical Characteristics - 125MSPS
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 ADC Features
        1. 6.3.1.1 Low Latency Mode
        2. 6.3.1.2 Full Digital Feature Mode
        3. 6.3.1.3 Interleaving Mode
      2. 6.3.2 Analog Input
        1. 6.3.2.1 Single Ended Input
        2. 6.3.2.2 Differential Input
        3. 6.3.2.3 Analog Input Bandwidth
      3. 6.3.3 Sampling Clock Input
      4. 6.3.4 Voltage Reference
      5. 6.3.5 Over-range (OVR)
      6. 6.3.6 Digital Features
        1. 6.3.6.1 Digital Down Converter
          1. 6.3.6.1.1 Digital Down Converter Data Select
          2. 6.3.6.1.2 Decimation Filter
          3. 6.3.6.1.3 DDC Over-range
          4. 6.3.6.1.4 Output Formatting with Decimation
        2. 6.3.6.2 Digital Comparator
          1. 6.3.6.2.1 Comparator Data Select
          2. 6.3.6.2.2 Comparator High and Low Threshold
          3. 6.3.6.2.3 Comparator Configuration Compare Mode
          4. 6.3.6.2.4 Comparator Event Configuration
        3. 6.3.6.3 Statistics Engine
          1. 6.3.6.3.1 Statistics Engine Data Select
          2. 6.3.6.3.2 Window Configuration
        4. 6.3.6.4 Digital Alerts
      7. 6.3.7 Digital Interface
        1. 6.3.7.1 Parallel CMOS Output
        2. 6.3.7.2 Serialized CMOS Output
      8. 6.3.8 Test Patterns
        1. 6.3.8.1 Bypass Test Pattern
        2. 6.3.8.2 Digital Test Pattern
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Power Down Options
    5. 6.5 Programming
      1. 6.5.1 Configuration using the SPI interface
        1. 6.5.1.1 Register Write
        2. 6.5.1.2 Register Read
    6. 6.6 Register Maps
      1. 6.6.1 Register Descriptions
      2. 6.6.2 Statistics Engine Register Map
      3. 6.6.3 Alerts Register Map
  8. 7 Application Information Disclaimer
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Signal Path
        2. 7.2.2.2 Sampling Clock
        3. 7.2.2.3 Voltage Reference
      3. 7.2.3 Application Curves
    3. 7.3 Initialization Set Up
      1. 7.3.1 Register Initialization During Operation
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.1 Layout Guidelines

There are several critical signals which require specific care during board design:

  1. Analog input and clock signals
    • Traces should be as short as possible and vias should be avoided where possible to minimize impedance discontinuities.
  2. Digital output interface

    • Traces should be as short as possible to reduce capacitive load seen by the CMOS outputs.

    • Series resistance should be used to reduce instantaneous current demand and improve signal integrity.
  3. Power and ground connections
    • Provide low resistance connection paths to all power and ground pins.
    • Use power and ground planes instead of traces.
    • Avoid narrow, isolated paths which increase the connection resistance.
    • Use a signal/ground/power circuit board stackup to maximize coupling between the ground and power plane.