SBAS661C February   2015  – May 2021 ADS1262 , ADS1263

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Serial Interface
    7. 7.7 Switching Characteristics: Serial Interface
    8. 7.8 Timing Diagrams
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Offset Temperature Drift Measurement
    2. 8.2 Gain Temperature Drift Measurement
    3. 8.3 Common-Mode Rejection Ratio Measurement
    4. 8.4 Power-Supply Rejection Ratio Measurement
    5. 8.5 Crosstalk Measurement (ADS1263)
    6. 8.6 Reference-Voltage Temperature-Drift Measurement
    7. 8.7 Reference-Voltage Thermal-Hysteresis Measurement
    8. 8.8 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Multifunction Analog Inputs
      2. 9.3.2  Analog Input Description
        1. 9.3.2.1 ESD Diode
        2. 9.3.2.2 Input Multiplexer
      3. 9.3.3  Sensor Bias
      4. 9.3.4  Temperature Sensor
      5. 9.3.5  Power-Supply Monitor
      6. 9.3.6  PGA
      7. 9.3.7  PGA Voltage Overrange Monitors
        1. 9.3.7.1 PGA Differential Output Monitor
        2. 9.3.7.2 PGA Absolute Output-Voltage Monitor
      8. 9.3.8  ADC Reference Voltage
        1. 9.3.8.1 Internal Reference
        2. 9.3.8.2 External Reference
        3. 9.3.8.3 Power-Supply Reference
        4. 9.3.8.4 Low-Reference Monitor
      9. 9.3.9  ADC1 Modulator
      10. 9.3.10 Digital Filter
        1. 9.3.10.1 Sinc Filter Mode
          1. 9.3.10.1.1 Sinc Filter Frequency Response
        2. 9.3.10.2 FIR Filter
        3. 9.3.10.3 50-Hz and 60-Hz Line Cycle Rejection
      11. 9.3.11 Sensor-Excitation Current Sources (IDAC1 and IDAC2)
      12. 9.3.12 Level-Shift Voltage
      13. 9.3.13 General-Purpose Input/Output (GPIO)
      14. 9.3.14 Test DAC (TDAC)
      15. 9.3.15 ADC2 (ADS1263)
        1. 9.3.15.1 ADC2 Inputs
        2. 9.3.15.2 ADC2 PGA
        3. 9.3.15.3 ADC2 Reference
        4. 9.3.15.4 ADC2 Modulator
        5. 9.3.15.5 ADC2 Digital Filter
    4. 9.4 Device Functional Modes
      1. 9.4.1  Conversion Control
        1. 9.4.1.1 Continuous Conversion Mode
        2. 9.4.1.2 Pulse Conversion Mode
        3. 9.4.1.3 ADC2 Conversion Control (ADS1263)
      2. 9.4.2  Conversion Latency
      3. 9.4.3  Programmable Time Delay
      4. 9.4.4  Serial Interface
        1. 9.4.4.1 Chip Select (CS)
        2. 9.4.4.2 Serial Clock (SCLK)
        3. 9.4.4.3 Data Input (DIN)
        4. 9.4.4.4 Data Output/Data Ready (DOUT/DRDY)
        5. 9.4.4.5 Serial Interface Autoreset
      5. 9.4.5  Data Ready Pin (DRDY)
      6. 9.4.6  Conversion Data Software Polling
      7. 9.4.7  Read Conversion Data
        1. 9.4.7.1 Read Data Direct (ADC1 Only)
        2. 9.4.7.2 Read Data by Command
        3. 9.4.7.3 Data-Byte Sequence
          1. 9.4.7.3.1 Status Byte
          2. 9.4.7.3.2 Data Byte Format
          3. 9.4.7.3.3 Checksum Byte (CRC/CHK)
            1. 9.4.7.3.3.1 Checksum Mode (CRC[1:0] = 01h)
          4. 9.4.7.3.4 CRC Mode (CRC[1:0] = 10h)
      8. 9.4.8  ADC Clock Modes
        1. 9.4.8.1 Internal Oscillator
        2. 9.4.8.2 External Clock
        3. 9.4.8.3 Crystal Oscillator
      9. 9.4.9  Calibration
        1. 9.4.9.1 Offset and Full-Scale Calibration
          1. 9.4.9.1.1 Offset Calibration Registers
          2. 9.4.9.1.2 Full-Scale Calibration Registers
        2. 9.4.9.2 ADC1 Offset Self-Calibration (SFOCAL1)
        3. 9.4.9.3 ADC1 Offset System Calibration (SYOCAL1)
        4. 9.4.9.4 ADC2 Offset Self-Calibration ADC2 (SFOCAL2)
        5. 9.4.9.5 ADC2 Offset System Calibration ADC2 (SYOCAL2)
        6. 9.4.9.6 ADC1 Full-Scale System Calibration (SYGCAL1)
        7. 9.4.9.7 ADC2 Full-Scale System Calibration ADC2 (SYGCAL2)
        8. 9.4.9.8 Calibration Command Procedure
        9. 9.4.9.9 User Calibration Procedure
      10. 9.4.10 Reset
        1. 9.4.10.1 Power-On Reset (POR)
        2. 9.4.10.2 RESET/PWDN Pin
        3. 9.4.10.3 Reset by Command
      11. 9.4.11 Power-Down Mode
      12. 9.4.12 Chop Mode
    5. 9.5 Programming
      1. 9.5.1 NOP Command
      2. 9.5.2 RESET Command
      3. 9.5.3 START1, STOP1, START2, STOP2 Commands
      4. 9.5.4 RDATA1, RDATA2 Commands
      5. 9.5.5 SYOCAL1, SYGCAL1, SFOCAL1, SYOCAL2, SYGCAL2, SFOCAL2 Commands
      6. 9.5.6 RREG Command
      7. 9.5.7 WREG Command
    6. 9.6 Register Maps
      1. 9.6.1  Device Identification Register (address = 00h) [reset = x]
      2. 9.6.2  Power Register (address = 01h) [reset = 11h]
      3. 9.6.3  Interface Register (address = 02h) [reset = 05h]
      4. 9.6.4  Mode0 Register (address = 03h) [reset = 00h]
      5. 9.6.5  Mode1 Register (address = 04h) [reset = 80h]
      6. 9.6.6  Mode2 Register (address = 05h) [reset = 04h]
      7. 9.6.7  Input Multiplexer Register (address = 06h) [reset = 01h]
      8. 9.6.8  Offset Calibration Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
      9. 9.6.9  Full-Scale Calibration Registers (address = 0Ah, 0Bh, 0Ch) [reset = 40h, 00h, 00h]
      10. 9.6.10 IDACMUX Register (address = 0Dh) [reset = BBh]
      11. 9.6.11 IDACMAG Register (address = 0Eh) [reset = 00h]
      12. 9.6.12 REFMUX Register (address = 0Fh) [reset = 00h]
      13. 9.6.13 TDACP Control Register (address = 10h) [reset = 00h]
      14. 9.6.14 TDACN Control Register (address = 11h) [reset = 00h]
      15. 9.6.15 GPIO Connection Register (address = 12h) [reset = 00h]
      16. 9.6.16 GPIO Direction Register (address = 13h) [reset = 00h]
      17. 9.6.17 GPIO Data Register (address = 14h) [reset = 00h]
      18. 9.6.18 ADC2 Configuration Register (address = 15h) [reset = 00h]
      19. 9.6.19 ADC2 Input Multiplexer Register (address = 16h) [reset = 01h]
      20. 9.6.20 ADC2 Offset Calibration Registers (address = 17h, 18h) [reset = 00h, 00h]
      21. 9.6.21 ADC2 Full-Scale Calibration Registers (address = 19h, 1Ah) [reset = 00h, 40h]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Isolated (or Floated) Inputs
      2. 10.1.2 Single-Ended Measurements
      3. 10.1.3 Differential Measurements
      4. 10.1.4 Input Range
      5. 10.1.5 Input Filtering
        1. 10.1.5.1 Aliasing
      6. 10.1.6 Input Overload
      7. 10.1.7 Unused Inputs and Outputs
      8. 10.1.8 Voltage Reference
      9. 10.1.9 Serial Interface Connections
    2. 10.2 Typical Application
      1. 10.2.1 3-Wire RTD Measurement with Lead-Wire Compensation
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
    3. 10.3 What To Do and What Not To Do
    4. 10.4 Initialization Setup
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Analog Power-Supply Clamp
    3. 11.3 Power-Supply Sequencing
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary

Package Options

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Orderable Information

9.3.14 Test DAC (TDAC)

The ADC includes a test voltage digital-to-analog converter (TDAC) intended for ADC self-testing and verification. The TDAC is capable of providing single-ended, differential and common mode test voltages. The voltages are suitable to test the ADCs under all gains and input configurations.

As shown in Figure 9-28, the TDAC consists of two independent DACs, TDACP, and TDACN. The DACs have independent control registers to program the output voltage. TDACP is programmed by register TDACP and TDACN is programmed by register TDACN. The TDACP output connects to the ADC1 and ADC2 positive input multiplexer input and TDACN connects to the ADC1 and ADC2 negative input multiplexer. The OUT1 and OUT2 bits can be programmed to connect the TDAC outputs to pins AIN6 and AIN7. The TDAC outputs are unbuffered and should not be loaded. The TDAC reference voltage is the analog supply (VAVDD – VAVSS); therefore, the output levels refer to, and scale with, the analog power supply. Note that chop mode must be disabled to test the ADC with the TDAC.

GUID-FB7F3164-1B32-4C37-B160-2917F844E039-low.gifFigure 9-28 Test DAC Block Diagram

Table 9-8 shows the TDAC output voltages and the corresponding output impedance. The TDAC settings are binary-weighted and correspond to the binary-weighted ADC gains. To generate a single ended test voltage, set TDACN = 00h. This value sets the TDACN voltage to mid-supply. Set TDACP above or below the TDACN voltage to generate positive or negative test voltages, respectively. Differential test voltages are generated by setting TDACP and TDACN to symmetric values centered around a common-code value (typical common value = 00h). For example, use code values equal to 01h and 11h, 02h and 12h, and so forth, to generate a differential voltage. To generate common-mode test voltages, set the TDACs to equal values.

Table 9-8 TDAC Output Voltage
TDACP, TDACN
REGISTER VALUES		DIVIDER RATIO
(V/V)		OUTPUT VOLTAGE (V),
5-V SUPPLY(1)		OUTPUT VOLTAGE (V),
±2.5-V SUPPLY(1)		OUTPUT IMPEDANCE
(kΩ)
09h0.94.522.9
08h0.73.516.4
07h0.630.58.7
06h0.552.750.2510
05h0.5252.6250.12510.7
04h0.51252.56250.06259.6
03h0.506252.531250.031258.7
02h0.5031252.5156250.0156258.1
01h0.50156252.50781250.00781257.8
00h0.52.507.5
11h0.49843752.4921875–0.00781257.8
12h0.4968752.484375–0.0156258.1
13h0.493752.46875–0.031258.7
14h0.48752.4375–0.06259.6
15h0.4752.375–0.12510.7
16h0.452.25–0.2510
17h0.42–0.58.7
18h0.31.5–16.4
19h0.10.5–22.9
(1) Output voltages relative to VDGND.