SBAS661C February   2015  – May 2021 ADS1262 , ADS1263

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Serial Interface
    7. 7.7 Switching Characteristics: Serial Interface
    8. 7.8 Timing Diagrams
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Offset Temperature Drift Measurement
    2. 8.2 Gain Temperature Drift Measurement
    3. 8.3 Common-Mode Rejection Ratio Measurement
    4. 8.4 Power-Supply Rejection Ratio Measurement
    5. 8.5 Crosstalk Measurement (ADS1263)
    6. 8.6 Reference-Voltage Temperature-Drift Measurement
    7. 8.7 Reference-Voltage Thermal-Hysteresis Measurement
    8. 8.8 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Multifunction Analog Inputs
      2. 9.3.2  Analog Input Description
        1. 9.3.2.1 ESD Diode
        2. 9.3.2.2 Input Multiplexer
      3. 9.3.3  Sensor Bias
      4. 9.3.4  Temperature Sensor
      5. 9.3.5  Power-Supply Monitor
      6. 9.3.6  PGA
      7. 9.3.7  PGA Voltage Overrange Monitors
        1. 9.3.7.1 PGA Differential Output Monitor
        2. 9.3.7.2 PGA Absolute Output-Voltage Monitor
      8. 9.3.8  ADC Reference Voltage
        1. 9.3.8.1 Internal Reference
        2. 9.3.8.2 External Reference
        3. 9.3.8.3 Power-Supply Reference
        4. 9.3.8.4 Low-Reference Monitor
      9. 9.3.9  ADC1 Modulator
      10. 9.3.10 Digital Filter
        1. 9.3.10.1 Sinc Filter Mode
          1. 9.3.10.1.1 Sinc Filter Frequency Response
        2. 9.3.10.2 FIR Filter
        3. 9.3.10.3 50-Hz and 60-Hz Line Cycle Rejection
      11. 9.3.11 Sensor-Excitation Current Sources (IDAC1 and IDAC2)
      12. 9.3.12 Level-Shift Voltage
      13. 9.3.13 General-Purpose Input/Output (GPIO)
      14. 9.3.14 Test DAC (TDAC)
      15. 9.3.15 ADC2 (ADS1263)
        1. 9.3.15.1 ADC2 Inputs
        2. 9.3.15.2 ADC2 PGA
        3. 9.3.15.3 ADC2 Reference
        4. 9.3.15.4 ADC2 Modulator
        5. 9.3.15.5 ADC2 Digital Filter
    4. 9.4 Device Functional Modes
      1. 9.4.1  Conversion Control
        1. 9.4.1.1 Continuous Conversion Mode
        2. 9.4.1.2 Pulse Conversion Mode
        3. 9.4.1.3 ADC2 Conversion Control (ADS1263)
      2. 9.4.2  Conversion Latency
      3. 9.4.3  Programmable Time Delay
      4. 9.4.4  Serial Interface
        1. 9.4.4.1 Chip Select (CS)
        2. 9.4.4.2 Serial Clock (SCLK)
        3. 9.4.4.3 Data Input (DIN)
        4. 9.4.4.4 Data Output/Data Ready (DOUT/DRDY)
        5. 9.4.4.5 Serial Interface Autoreset
      5. 9.4.5  Data Ready Pin (DRDY)
      6. 9.4.6  Conversion Data Software Polling
      7. 9.4.7  Read Conversion Data
        1. 9.4.7.1 Read Data Direct (ADC1 Only)
        2. 9.4.7.2 Read Data by Command
        3. 9.4.7.3 Data-Byte Sequence
          1. 9.4.7.3.1 Status Byte
          2. 9.4.7.3.2 Data Byte Format
          3. 9.4.7.3.3 Checksum Byte (CRC/CHK)
            1. 9.4.7.3.3.1 Checksum Mode (CRC[1:0] = 01h)
          4. 9.4.7.3.4 CRC Mode (CRC[1:0] = 10h)
      8. 9.4.8  ADC Clock Modes
        1. 9.4.8.1 Internal Oscillator
        2. 9.4.8.2 External Clock
        3. 9.4.8.3 Crystal Oscillator
      9. 9.4.9  Calibration
        1. 9.4.9.1 Offset and Full-Scale Calibration
          1. 9.4.9.1.1 Offset Calibration Registers
          2. 9.4.9.1.2 Full-Scale Calibration Registers
        2. 9.4.9.2 ADC1 Offset Self-Calibration (SFOCAL1)
        3. 9.4.9.3 ADC1 Offset System Calibration (SYOCAL1)
        4. 9.4.9.4 ADC2 Offset Self-Calibration ADC2 (SFOCAL2)
        5. 9.4.9.5 ADC2 Offset System Calibration ADC2 (SYOCAL2)
        6. 9.4.9.6 ADC1 Full-Scale System Calibration (SYGCAL1)
        7. 9.4.9.7 ADC2 Full-Scale System Calibration ADC2 (SYGCAL2)
        8. 9.4.9.8 Calibration Command Procedure
        9. 9.4.9.9 User Calibration Procedure
      10. 9.4.10 Reset
        1. 9.4.10.1 Power-On Reset (POR)
        2. 9.4.10.2 RESET/PWDN Pin
        3. 9.4.10.3 Reset by Command
      11. 9.4.11 Power-Down Mode
      12. 9.4.12 Chop Mode
    5. 9.5 Programming
      1. 9.5.1 NOP Command
      2. 9.5.2 RESET Command
      3. 9.5.3 START1, STOP1, START2, STOP2 Commands
      4. 9.5.4 RDATA1, RDATA2 Commands
      5. 9.5.5 SYOCAL1, SYGCAL1, SFOCAL1, SYOCAL2, SYGCAL2, SFOCAL2 Commands
      6. 9.5.6 RREG Command
      7. 9.5.7 WREG Command
    6. 9.6 Register Maps
      1. 9.6.1  Device Identification Register (address = 00h) [reset = x]
      2. 9.6.2  Power Register (address = 01h) [reset = 11h]
      3. 9.6.3  Interface Register (address = 02h) [reset = 05h]
      4. 9.6.4  Mode0 Register (address = 03h) [reset = 00h]
      5. 9.6.5  Mode1 Register (address = 04h) [reset = 80h]
      6. 9.6.6  Mode2 Register (address = 05h) [reset = 04h]
      7. 9.6.7  Input Multiplexer Register (address = 06h) [reset = 01h]
      8. 9.6.8  Offset Calibration Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
      9. 9.6.9  Full-Scale Calibration Registers (address = 0Ah, 0Bh, 0Ch) [reset = 40h, 00h, 00h]
      10. 9.6.10 IDACMUX Register (address = 0Dh) [reset = BBh]
      11. 9.6.11 IDACMAG Register (address = 0Eh) [reset = 00h]
      12. 9.6.12 REFMUX Register (address = 0Fh) [reset = 00h]
      13. 9.6.13 TDACP Control Register (address = 10h) [reset = 00h]
      14. 9.6.14 TDACN Control Register (address = 11h) [reset = 00h]
      15. 9.6.15 GPIO Connection Register (address = 12h) [reset = 00h]
      16. 9.6.16 GPIO Direction Register (address = 13h) [reset = 00h]
      17. 9.6.17 GPIO Data Register (address = 14h) [reset = 00h]
      18. 9.6.18 ADC2 Configuration Register (address = 15h) [reset = 00h]
      19. 9.6.19 ADC2 Input Multiplexer Register (address = 16h) [reset = 01h]
      20. 9.6.20 ADC2 Offset Calibration Registers (address = 17h, 18h) [reset = 00h, 00h]
      21. 9.6.21 ADC2 Full-Scale Calibration Registers (address = 19h, 1Ah) [reset = 00h, 40h]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Isolated (or Floated) Inputs
      2. 10.1.2 Single-Ended Measurements
      3. 10.1.3 Differential Measurements
      4. 10.1.4 Input Range
      5. 10.1.5 Input Filtering
        1. 10.1.5.1 Aliasing
      6. 10.1.6 Input Overload
      7. 10.1.7 Unused Inputs and Outputs
      8. 10.1.8 Voltage Reference
      9. 10.1.9 Serial Interface Connections
    2. 10.2 Typical Application
      1. 10.2.1 3-Wire RTD Measurement with Lead-Wire Compensation
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
    3. 10.3 What To Do and What Not To Do
    4. 10.4 Initialization Setup
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Analog Power-Supply Clamp
    3. 11.3 Power-Supply Sequencing
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.7.2 Read Data by Command

In this method of data retrieval, a command is used to read ADC1 or ADC2 data. When the command is sent, the data are retrieved from the respective ADC data-holding register. Read the data at any time because the command method does not require synchronizing to DRDY. In addition to hardware polling of DRDY or DOUT/DRDY to determine when ADC1 data are ready, the ADC can be software polled by reading bits ADC1 and ADC2 of the status byte. If the ADC1 or ADC2 status bit is 1, the ADC1 or ADC2 data are new since the last ADC1 or ADC2 read operation. If data are read again before the new data are ready, the status bit is 0 and the previous data are returned. ADC2 data can only be read by the command method.

Figure 9-44 shows the read data by command sequence. The output data MSB begins on the first rising edge of SCLK after the command. The output data field can be 4, 5, or 6 bytes long, depending on programming. The data field consists of an optional status byte, four bytes of conversion data, and an optional checksum byte. The ADC2 data block consists of the optional status byte, 3 bytes of data, a fixed-value byte equal to 00h (zero pad byte), and the optional checksum byte. A read data command must be sent for each read operation. The ADC does not respond to commands until the read operation is complete, or terminated by taking CS high.

GUID-638F20A7-E4C9-41AD-8C5E-125D4FD3C1CD-low.gif
CS can be tied low. If CS is low, DOUT/DRDY asserts low with DRDY.
In continuous conversion mode, DRDY returns high on the first SCLK falling edge of sending the opcode. For pulse conversion mode, DRDY stays low until the next conversion is started.
Read ADC1 command byte = 12h or 13h, Read ADC2 command byte = 14h or 15h
DOUT/DRDY is driven low with DRDY. If a read operation occurs after DRDY falling edge, then DOUT can be high or low.
The STATUS and CRC/CHK bytes are optional.
Figure 9-44 Read Data by Command