SBAS661C
February 2015 – May 2021
ADS1262
,
ADS1263
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements: Serial Interface
7.7
Switching Characteristics: Serial Interface
7.8
Timing Diagrams
7.9
Typical Characteristics
8
Parameter Measurement Information
8.1
Offset Temperature Drift Measurement
8.2
Gain Temperature Drift Measurement
8.3
Common-Mode Rejection Ratio Measurement
8.4
Power-Supply Rejection Ratio Measurement
8.5
Crosstalk Measurement (ADS1263)
8.6
Reference-Voltage Temperature-Drift Measurement
8.7
Reference-Voltage Thermal-Hysteresis Measurement
8.8
Noise Performance
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Multifunction Analog Inputs
9.3.2
Analog Input Description
9.3.2.1
ESD Diode
9.3.2.2
Input Multiplexer
9.3.3
Sensor Bias
9.3.4
Temperature Sensor
9.3.5
Power-Supply Monitor
9.3.6
PGA
9.3.7
PGA Voltage Overrange Monitors
9.3.7.1
PGA Differential Output Monitor
9.3.7.2
PGA Absolute Output-Voltage Monitor
9.3.8
ADC Reference Voltage
9.3.8.1
Internal Reference
9.3.8.2
External Reference
9.3.8.3
Power-Supply Reference
9.3.8.4
Low-Reference Monitor
9.3.9
ADC1 Modulator
9.3.10
Digital Filter
9.3.10.1
Sinc Filter Mode
9.3.10.1.1
Sinc Filter Frequency Response
9.3.10.2
FIR Filter
9.3.10.3
50-Hz and 60-Hz Line Cycle Rejection
9.3.11
Sensor-Excitation Current Sources (IDAC1 and IDAC2)
9.3.12
Level-Shift Voltage
9.3.13
General-Purpose Input/Output (GPIO)
9.3.14
Test DAC (TDAC)
9.3.15
ADC2 (ADS1263)
9.3.15.1
ADC2 Inputs
9.3.15.2
ADC2 PGA
9.3.15.3
ADC2 Reference
9.3.15.4
ADC2 Modulator
9.3.15.5
ADC2 Digital Filter
9.4
Device Functional Modes
9.4.1
Conversion Control
9.4.1.1
Continuous Conversion Mode
9.4.1.2
Pulse Conversion Mode
9.4.1.3
ADC2 Conversion Control (ADS1263)
9.4.2
Conversion Latency
9.4.3
Programmable Time Delay
9.4.4
Serial Interface
9.4.4.1
Chip Select (CS)
9.4.4.2
Serial Clock (SCLK)
9.4.4.3
Data Input (DIN)
9.4.4.4
Data Output/Data Ready (DOUT/DRDY)
9.4.4.5
Serial Interface Autoreset
9.4.5
Data Ready Pin (DRDY)
9.4.6
Conversion Data Software Polling
9.4.7
Read Conversion Data
9.4.7.1
Read Data Direct (ADC1 Only)
9.4.7.2
Read Data by Command
9.4.7.3
Data-Byte Sequence
9.4.7.3.1
Status Byte
9.4.7.3.2
Data Byte Format
9.4.7.3.3
Checksum Byte (CRC/CHK)
9.4.7.3.3.1
Checksum Mode (CRC[1:0] = 01h)
9.4.7.3.4
CRC Mode (CRC[1:0] = 10h)
9.4.8
ADC Clock Modes
9.4.8.1
Internal Oscillator
9.4.8.2
External Clock
9.4.8.3
Crystal Oscillator
9.4.9
Calibration
9.4.9.1
Offset and Full-Scale Calibration
9.4.9.1.1
Offset Calibration Registers
9.4.9.1.2
Full-Scale Calibration Registers
9.4.9.2
ADC1 Offset Self-Calibration (SFOCAL1)
9.4.9.3
ADC1 Offset System Calibration (SYOCAL1)
9.4.9.4
ADC2 Offset Self-Calibration ADC2 (SFOCAL2)
9.4.9.5
ADC2 Offset System Calibration ADC2 (SYOCAL2)
9.4.9.6
ADC1 Full-Scale System Calibration (SYGCAL1)
9.4.9.7
ADC2 Full-Scale System Calibration ADC2 (SYGCAL2)
9.4.9.8
Calibration Command Procedure
9.4.9.9
User Calibration Procedure
9.4.10
Reset
9.4.10.1
Power-On Reset (POR)
9.4.10.2
RESET/PWDN Pin
9.4.10.3
Reset by Command
9.4.11
Power-Down Mode
9.4.12
Chop Mode
9.5
Programming
9.5.1
NOP Command
9.5.2
RESET Command
9.5.3
START1, STOP1, START2, STOP2 Commands
9.5.4
RDATA1, RDATA2 Commands
9.5.5
SYOCAL1, SYGCAL1, SFOCAL1, SYOCAL2, SYGCAL2, SFOCAL2 Commands
9.5.6
RREG Command
9.5.7
WREG Command
9.6
Register Maps
9.6.1
Device Identification Register (address = 00h) [reset = x]
9.6.2
Power Register (address = 01h) [reset = 11h]
9.6.3
Interface Register (address = 02h) [reset = 05h]
9.6.4
Mode0 Register (address = 03h) [reset = 00h]
9.6.5
Mode1 Register (address = 04h) [reset = 80h]
9.6.6
Mode2 Register (address = 05h) [reset = 04h]
9.6.7
Input Multiplexer Register (address = 06h) [reset = 01h]
9.6.8
Offset Calibration Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
9.6.9
Full-Scale Calibration Registers (address = 0Ah, 0Bh, 0Ch) [reset = 40h, 00h, 00h]
9.6.10
IDACMUX Register (address = 0Dh) [reset = BBh]
9.6.11
IDACMAG Register (address = 0Eh) [reset = 00h]
9.6.12
REFMUX Register (address = 0Fh) [reset = 00h]
9.6.13
TDACP Control Register (address = 10h) [reset = 00h]
9.6.14
TDACN Control Register (address = 11h) [reset = 00h]
9.6.15
GPIO Connection Register (address = 12h) [reset = 00h]
9.6.16
GPIO Direction Register (address = 13h) [reset = 00h]
9.6.17
GPIO Data Register (address = 14h) [reset = 00h]
9.6.18
ADC2 Configuration Register (address = 15h) [reset = 00h]
9.6.19
ADC2 Input Multiplexer Register (address = 16h) [reset = 01h]
9.6.20
ADC2 Offset Calibration Registers (address = 17h, 18h) [reset = 00h, 00h]
9.6.21
ADC2 Full-Scale Calibration Registers (address = 19h, 1Ah) [reset = 00h, 40h]
10
Application and Implementation
10.1
Application Information
10.1.1
Isolated (or Floated) Inputs
10.1.2
Single-Ended Measurements
10.1.3
Differential Measurements
10.1.4
Input Range
10.1.5
Input Filtering
10.1.5.1
Aliasing
10.1.6
Input Overload
10.1.7
Unused Inputs and Outputs
10.1.8
Voltage Reference
10.1.9
Serial Interface Connections
10.2
Typical Application
10.2.1
3-Wire RTD Measurement with Lead-Wire Compensation
10.2.1.1
Design Requirements
10.2.1.2
Detailed Design Procedure
10.2.1.3
Application Curve
10.3
What To Do and What Not To Do
10.4
Initialization Setup
11
Power Supply Recommendations
11.1
Power-Supply Decoupling
11.2
Analog Power-Supply Clamp
11.3
Power-Supply Sequencing
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
Device and Documentation Support
13.1
Receiving Notification of Documentation Updates
13.2
Support Resources
13.3
Trademarks
13.4
Electrostatic Discharge Caution
13.5
Glossary
Package Options
Mechanical Data (Package|Pins)
PW|28
MPDS364
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbas661c_oa
sbas661c_pm
13.5
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.