SBASAY5 June   2024 ADS8681W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input Structure
      2. 6.3.2 Analog Input Impedance
      3. 6.3.3 Input Protection Circuit
      4. 6.3.4 Programmable Gain Amplifier (PGA)
      5. 6.3.5 Second-Order, Low-Pass Filter (LPF)
      6. 6.3.6 ADC Driver
      7. 6.3.7 Reference
        1. 6.3.7.1 Internal Reference
        2. 6.3.7.2 External Reference
      8. 6.3.8 ADC Transfer Function
      9. 6.3.9 Alarm Features
        1. 6.3.9.1 Input Alarm
        2. 6.3.9.2 AVDD Alarm
    4. 6.4 Device Functional Modes
      1. 6.4.1 Host-to-Device Connection Topologies
        1. 6.4.1.1 Single Device: All multiSPI Options
        2. 6.4.1.2 Single Device: Standard SPI Interface
        3. 6.4.1.3 Multiple Devices: Daisy-Chain Topology
      2. 6.4.2 Device Operational Modes
        1. 6.4.2.1 RESET State
        2. 6.4.2.2 ACQ State
        3. 6.4.2.3 CONV State
    5. 6.5 Programming
      1. 6.5.1 Data Transfer Frame
      2. 6.5.2 Input Command Word and Register Write Operation
      3. 6.5.3 Output Data Word
      4. 6.5.4 Data Transfer Protocols
        1. 6.5.4.1 Protocols for Configuring the Device
        2. 6.5.4.2 Protocols for Reading From the Device
          1. 6.5.4.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols With a Single SDO-x
          2. 6.5.4.2.2 Legacy, SPI-Compatible (SYS-xy-S) Protocols With Dual SDO-x
          3. 6.5.4.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.4.2.3.1 Output Clock Source Options
            2. 6.5.4.2.3.2 Output Bus Width Options
  8. 7 Register Maps
    1. 7.1 Device Configuration and Register Maps
      1. 7.1.1 DEVICE_ID_REG Register (address = 00h)
      2. 7.1.2 RST_PWRCTL_REG Register (address = 04h)
      3. 7.1.3 SDI_CTL_REG Register (address = 08h)
      4. 7.1.4 SDO_CTL_REG Register (address = 0Ch)
      5. 7.1.5 DATAOUT_CTL_REG Register (address = 10h)
      6. 7.1.6 RANGE_SEL_REG Register (address = 14h)
      7. 7.1.7 ALARM_REG Register (address = 20h)
      8. 7.1.8 ALARM_H_TH_REG Register (address = 24h)
      9. 7.1.9 ALARM_L_TH_REG Register (address = 28h)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Alarm Function
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Decoupling
      2. 8.3.2 Power Saving
        1. 8.3.2.1 NAP Mode
        2. 8.3.2.2 Power-Down (PD) Mode
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4.2.1 RESET State

The device features an active-low RST pin that is an asynchronous digital input. To enter a RESET state, pull and keep the RST pin low for the twl_RST duration (as specified in the Timing Requirements table).

The device features two different types of reset functions: an application reset or a power-on reset (POR). The functionality of the RST pin is determined by the state of the RSTn_APP bit in the RST_PWRCTL_REG register.

  • To configure the RST pin to issue an application reset, configure the RSTn_APP bit in the RST_PWRCTL_REG register to 1b. In this RESET state, all configuration registers (see the Register Maps) are reset to default values, RVS pins remain low, and SDO-x pins are tri-stated.
  • The default configuration for the RST pin issues a power-on reset when pulled to a low level. The RSTn_APP bit is set to 0b in this state. When a POR is issued, all internal device circuitry (including the PGA, ADC driver, and voltage reference) are reset. When the device comes out of the POR state, allow for the tD_RST_POR time duration so the internal circuitry accurately settles. See the Timing Requirements table for the tD_RST_POR time duration.

To exit any of the RESET states, pull the RST pin high with CONVST/CS and SCLK held low. After a delay of tD_RST_POR or tD_RST_APP (see the Timing Requirements table), the device enters ACQ state and the RVS pin goes high.

To operate the device in any of the other two states (ACQ or CONV), hold the RST pin high. With the RST pin held high, transitions on the CONVST/CS pin determine the functional state of the device. A typical conversion cycle is illustrated in Figure 5-1.