Refer to the PDF data sheet for device specific package drawings
Flat-Panel, X-Ray Detector
The AFE1256 is a 256-channel, analog front-end (AFE) designed to suit the requirements of flat-panel detectors (FPDs) based on digital X-ray systems. The device includes 256 integrators, a programmable gain amplifier (PGA) for full-scale, charge-level selection, a correlated double sampler (CDS) with dual banking, 256:4 analog multiplexers, and four 16-bit, successive-approximation register (SAR) analog-to-digital converters (ADCs) onboard. Serial data from the ADCs are available in SPI™ format.
Hardware-selectable integration polarity allows for the integration of positive or negative charge and provides more flexibility in system design. The Nap feature enables substantial power saving. This power savings is especially useful in battery-powered systems.
The device is available as a 22-mm × 5-mm gold-bumped die and a 38-mm × 28-mm, COF-314 TDS package in singulated forms.
To request a full data sheet or other design resources: request AFE1256
ORDER NUMBER | PACKAGE | BODY SIZE |
---|---|---|
AFE1256GBTD | Gold-bump die (533) | 22 mm × 5 mm |
AFE1256TDS | COF (314) | 38 mm × 28 mm |
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Changes from C Revision (August 2015) to D Revision
Changes from B Revision (April 2014) to C Revision
Changes from A Revision (March 2014) to B Revision
Changes from * Revision (October 2013) to A Revision
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Tray dimensions for the TDS package is shown in Figure 1.
Figure 2 does not take into account the scribe seal.
Figure 3 provides the tray dimensions for the GBTD die.
Dies are placed active side up (bumps up) into waffle pack. The waffle pack notch is at the upper right, as shown in Figure 4.
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