SBASAC2 june   2023 AFE43902-Q1 , AFE53902-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output
    6. 6.6  Electrical Characteristics: ADC Input
    7. 6.7  Electrical Characteristics: General
    8. 6.8  Timing Requirements: I2C Standard Mode
    9. 6.9  Timing Requirements: I2C Fast Mode
    10. 6.10 Timing Requirements: I2C Fast Mode Plus
    11. 6.11 Timing Requirements: SPI Write Operation
    12. 6.12 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    13. 6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    14. 6.14 Timing Requirements: PWM Output
    15. 6.15 Timing Diagrams
    16. 6.16 Typical Characteristics: Voltage Output
    17. 6.17 Typical Characteristics: ADC
    18. 6.18 Typical Characteristics: General
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Smart Analog Front End (AFE) Architecture
      2. 7.3.2 Programming Interface
      3. 7.3.3 Nonvolatile Memory (NVM)
        1. 7.3.3.1 NVM Cyclic Redundancy Check (CRC)
          1. 7.3.3.1.1 NVM-CRC-FAIL-USER Bit
          2. 7.3.3.1.2 NVM-CRC-FAIL-INT Bit
      4. 7.3.4 Power-On Reset (POR)
      5. 7.3.5 External Reset
      6. 7.3.6 Register-Map Lock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Digital-to-Analog Converter (DAC) Mode
        1. 7.4.1.1 Voltage Reference and DAC Transfer Function
          1. 7.4.1.1.1 Power-Supply as Reference
          2. 7.4.1.1.2 Internal Reference
          3. 7.4.1.1.3 External Reference
      2. 7.4.2 Pulse-Width Modulation (PWM) Mode
      3. 7.4.3 Analog-to-Digital Converter (ADC) Mode
      4. 7.4.4 Multislope Thermal Foldback Mode
        1. 7.4.4.1 Thermistor Linearization
    5. 7.5 Programming
      1. 7.5.1 SPI Programming Mode
      2. 7.5.2 I2C Programming Mode
        1. 7.5.2.1 F/S Mode Protocol
        2. 7.5.2.2 I2C Update Sequence
          1. 7.5.2.2.1 Address Byte
          2. 7.5.2.2.2 Command Byte
        3. 7.5.2.3 I2C Read Sequence
    6. 7.6 Register Maps
      1. 7.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 7.6.2  DAC-x-VOUT-CMP-CONFIG Register (address = 15h, 03h) [reset = 0400h]
      3. 7.6.3  COMMON-CONFIG Register (address = 1Fh) [reset = 03F9h]
      4. 7.6.4  COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
      5. 7.6.5  COMMON-PWM-TRIG Register (address = 21h) [reset = 0001h]
      6. 7.6.6  GENERAL-STATUS Register (address = 22h) [reset = 2068h]
      7. 7.6.7  DEVICE-MODE-CONFIG Register (address = 25h) [reset = 8040h]
      8. 7.6.8  INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
      9. 7.6.9  STATE-MACHINE-CONFIG0 Register (address = 27h) [reset = 0003h]
      10. 7.6.10 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
      11. 7.6.11 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
      12. 7.6.12 Xx-TEMPERATURE Register (SRAM address = 20h, 22h, 24h) [reset = 0000h]
      13. 7.6.13 Yx-TEMPERATURE Register (SRAM address = 21h, 23h, 25h) [reset = 0000h]
      14. 7.6.14 Xx-OUTPUT Register (SRAM address = 26h, 28h, 2Ah, 2Ch) [reset = 0000h]
      15. 7.6.15 Yx-OUTPUT Register (SRAM address = 27h, 29h, 2Bh, 2Dh) [reset = 0000h]
      16. 7.6.16 PWM-FREQUENCY Register (SRAM address = 2Eh) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Multislope Thermal Foldback Using the AFE53902-Q1 and Voltage Output
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots
      2. 8.2.2 Multislope Thermal Foldback Using the AFE43902-Q1 and PWM Output
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) AFEx3902-Q1 UNIT
RTE (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 49 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50 °C/W
RθJB Junction-to-board thermal resistance 24.1 °C/W
ΨJT Junction-to-top characterization parameter 1.1 °C/W
ΨJB Junction-to-board characterization parameter 24.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 8.7 °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.