SLASEU7 March   2023 AFE781H1 , AFE881H1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements
    7. 6.7  Timing Diagrams
    8. 6.8  Typical Characteristics: VOUT DAC
    9. 6.9  Typical Characteristics: ADC
    10. 6.10 Typical Characteristics: Reference
    11. 6.11 Typical Characteristics: HART Modem
    12. 6.12 Typical Characteristics: Power Supply
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter (DAC) Overview
        1. 7.3.1.1 DAC Resistor String
        2. 7.3.1.2 DAC Buffer Amplifier
        3. 7.3.1.3 DAC Transfer Function
        4. 7.3.1.4 DAC Gain and Offset Calibration
        5. 7.3.1.5 Programmable Slew Rate
        6. 7.3.1.6 DAC Register Structure and CLEAR State
      2. 7.3.2 Analog-to-Digital Converter (ADC) Overview
        1. 7.3.2.1 ADC Operation
        2. 7.3.2.2 ADC Custom Channel Sequencer
        3. 7.3.2.3 ADC Synchronization
        4. 7.3.2.4 ADC Offset Calibration
        5. 7.3.2.5 External Monitoring Inputs
        6. 7.3.2.6 Temperature Sensor
        7. 7.3.2.7 Self-Diagnostic Multiplexer
        8. 7.3.2.8 ADC Bypass
      3. 7.3.3 Programmable Out-of-Range Alarms
        1. 7.3.3.1 Alarm-Based Interrupts
        2. 7.3.3.2 Alarm Action Configuration Register
        3. 7.3.3.3 Alarm Voltage Generator
        4. 7.3.3.4 Temperature Sensor Alarm Function
        5. 7.3.3.5 Internal Reference Alarm Function
        6. 7.3.3.6 ADC Alarm Function
        7. 7.3.3.7 Fault Detection
      4. 7.3.4 IRQ
      5. 7.3.5 HART Interface
        1. 7.3.5.1  FIFO Buffers
          1. 7.3.5.1.1 FIFO Buffer Access
          2. 7.3.5.1.2 FIFO Buffer Flags
        2. 7.3.5.2  HART Modulator
        3. 7.3.5.3  HART Demodulator
        4. 7.3.5.4  HART Modem Modes
          1. 7.3.5.4.1 Half-Duplex Mode
          2. 7.3.5.4.2 Full-Duplex Mode
        5. 7.3.5.5  HART Modulation and Demodulation Arbitration
          1. 7.3.5.5.1 HART Receive Mode
          2. 7.3.5.5.2 HART Transmit Mode
        6. 7.3.5.6  HART Modulator Timing and Preamble Requirements
        7. 7.3.5.7  HART Demodulator Timing and Preamble Requirements
        8. 7.3.5.8  IRQ Configuration for HART Communication
        9. 7.3.5.9  HART Communication Using the SPI
        10. 7.3.5.10 HART Communication Using UART
        11. 7.3.5.11 Memory Built-In Self-Test (MBIST)
      6. 7.3.6 Internal Reference
      7. 7.3.7 Integrated Precision Oscillator
      8. 7.3.8 One-Time Programmable (OTP) Memory
    4. 7.4 Device Functional Modes
      1. 7.4.1 DAC Power-Down Mode
      2. 7.4.2 Reset
    5. 7.5 Programming
      1. 7.5.1 Communication Setup
        1. 7.5.1.1 SPI Mode
        2. 7.5.1.2 UART Mode
        3. 7.5.1.3 SPI Plus UART Mode
        4. 7.5.1.4 HART Functionality Setup Options
      2. 7.5.2 Serial Peripheral Interface (SPI)
        1. 7.5.2.1 SPI Frame Definition
        2. 7.5.2.2 SPI Read and Write
        3. 7.5.2.3 Frame Error Checking
        4. 7.5.2.4 Synchronization
      3. 7.5.3 UART Interface
        1. 7.5.3.1 UART Break Mode (UBM)
          1. 7.5.3.1.1 Interface With FIFO Buffers and Register Map
      4. 7.5.4 Status Bits
      5. 7.5.5 Watchdog Timer
    6. 7.6 Register Maps
      1. 7.6.1 AFEx81H1 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multichannel Configuration
    2. 8.2 Typical Application
      1. 8.2.1 4-mA to 20-mA Current Transmitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Start-Up Circuit
          2. 8.2.1.2.2 Current Loop Control
          3. 8.2.1.2.3 Input Protection and Rectification
          4. 8.2.1.2.4 System Current Budget
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.2.4 Synchronization

The AFEx81H1 register map runs on the internal clock domain. Both the SPI and UBM packets are synchronized to this domain. This synchronization adds a latency of 0.4 µs to 1.22 µs (1.5 internal clocks), with respect to the rising edge of CS or the STOP bit of the last byte of the UBM packet.

The effect of clock synchronization on UBM communication is not evident because of the lower speed and asynchronous nature of UBM communication.

In SPI mode, if changing register bits CONFIG.DSDO, CONFIG.FSDO, or CONFIG.CRC_EN, keep CS high for at least two clock cycles before issuing the next frame. Frame data corruption can occur if the two extra cycles are not used. The following are examples of frame corruption:

  • Setting CONFIG.DSDO = 0: SDO begins to drive in the middle of the next frame.
  • Changing CONFIG.FSDO: The launching edge of SDO changes in the middle of the next frame.
  • Setting CONFIG.CRC_EN = 1: The next frame has a CRC error because the CRC is enabled in the middle of the frame.

Send a NOP command (SDI = 0x00_0000) after setting the DSDO, FSDO, and CRC_EN bits to prevent the corrupted frames from impacting communication. Sending a NOP after CONFIG.CRC_EN is set still generates a CRC error, and is reported in the STATUS portion of SDO. To avoid false errors, wait approximately 2 µs after setting CONFIG.CRC_EN before sending the next frame.