SLASF44A May   2023  – June 2024 AFE78201 , AFE88201

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements
    7. 5.7  Timing Diagrams
    8. 5.8  Typical Characteristics: VOUT DAC
    9. 5.9  Typical Characteristics: ADC
    10. 5.10 Typical Characteristics: Reference
    11. 5.11 Typical Characteristics: Power Supply
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Digital-to-Analog Converter (DAC) Overview
        1. 6.3.1.1 DAC Resistor String
        2. 6.3.1.2 DAC Buffer Amplifier
        3. 6.3.1.3 DAC Transfer Function
        4. 6.3.1.4 DAC Gain and Offset Calibration
        5. 6.3.1.5 Programmable Slew Rate
        6. 6.3.1.6 DAC Register Structure and CLEAR State
      2. 6.3.2  Analog-to-Digital Converter (ADC) Overview
        1. 6.3.2.1 ADC Operation
        2. 6.3.2.2 ADC Custom Channel Sequencer
        3. 6.3.2.3 ADC Synchronization
        4. 6.3.2.4 ADC Offset Calibration
        5. 6.3.2.5 External Monitoring Inputs
        6. 6.3.2.6 Temperature Sensor
        7. 6.3.2.7 Self-Diagnostic Multiplexer
        8. 6.3.2.8 ADC Bypass
      3. 6.3.3  Programmable Out-of-Range Alarms
        1. 6.3.3.1 Alarm-Based Interrupts
        2. 6.3.3.2 Alarm Action Configuration Register
        3. 6.3.3.3 Alarm Voltage Generator
        4. 6.3.3.4 Temperature Sensor Alarm Function
        5. 6.3.3.5 Internal Reference Alarm Function
        6. 6.3.3.6 ADC Alarm Function
        7. 6.3.3.7 Fault Detection
      4. 6.3.4  IRQ
      5. 6.3.5  Internal Reference
      6. 6.3.6  Integrated Precision Oscillator
      7. 6.3.7  Precision Oscillator Diagnostics
      8. 6.3.8  One-Time Programmable (OTP) Memory
      9. 6.3.9  GPIO
      10. 6.3.10 Timer
      11. 6.3.11 Unique Chip Identifier (ID)
      12. 6.3.12 Scratch Pad Register
    4. 6.4 Device Functional Modes
      1. 6.4.1 Register Built-In Self-Test (RBIST)
      2. 6.4.2 DAC Power-Down Mode
      3. 6.4.3 Reset
    5. 6.5 Programming
      1. 6.5.1 Communication Setup
        1. 6.5.1.1 SPI Mode
        2. 6.5.1.2 UART Mode
      2. 6.5.2 GPIO Programming
      3. 6.5.3 Serial Peripheral Interface (SPI)
        1. 6.5.3.1 SPI Frame Definition
        2. 6.5.3.2 SPI Read and Write
        3. 6.5.3.3 Frame Error Checking
        4. 6.5.3.4 Synchronization
      4. 6.5.4 UART Interface
        1. 6.5.4.1 UART Break Mode (UBM)
      5. 6.5.5 Status Bits
      6. 6.5.6 Watchdog Timer
  8. 7 Register Maps
    1. 7.1 AFEx8201 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multichannel Configuration
    2. 8.2 Typical Application
      1. 8.2.1 Analog Output Module
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 XTR305
            1. 8.2.1.2.1.1 Current-Output Mode
            2. 8.2.1.2.1.2 Voltage Output Mode
            3. 8.2.1.2.1.3 Diagnostic Features
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RRU|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.7 Precision Oscillator Diagnostics

The AFEx8201 features two methods to continuously detect the functional status of the internal precision oscillator.

The first method requires a connection from the AFEx8201 to the system controller. To use the first method, program the AFEx8201 to output a subdivided internal oscillator clock signal on the CLK_OUT pin. Write to the CONFIG.CLKO register field (see Table 7-5) to enable the output with the chosen divider or to disable the output. The output digital signal is compliant to the Section 5.5. The CLK_OUT pin is also a shared GPIO pin. For details on connecting CLK_OUT and CLK_OUT interoperability as a GPIO pin , see Section 6.5.1.

The second method does not require a connection from the AFEx8201 and is a polled-communication-based method to determine the functionality of the internal oscillator using SPI communication. See Section 6.5.3.1 and Section 6.5.5 for SPI communication details and SDO status bits details, respectively. The OSC_DIV_2 bit reports the logical value of a subdivided internal oscillator signal (divided by 2) sampled at the CS falling edge. Use an appropriate SCLK frequency and interval between SPI frames to capture bit changes from frame to frame as a method of verifying the continued proper operation of the clock. Similar status reports of the logical value of a subdivided internal oscillator signal (divided by 1024) are available in UBM as the OSC_DIV_1024 bit. For details on UBM frames and timing, see Section 6.5.4.1.