SLASF44A May   2023  – June 2024 AFE78201 , AFE88201

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements
    7. 5.7  Timing Diagrams
    8. 5.8  Typical Characteristics: VOUT DAC
    9. 5.9  Typical Characteristics: ADC
    10. 5.10 Typical Characteristics: Reference
    11. 5.11 Typical Characteristics: Power Supply
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Digital-to-Analog Converter (DAC) Overview
        1. 6.3.1.1 DAC Resistor String
        2. 6.3.1.2 DAC Buffer Amplifier
        3. 6.3.1.3 DAC Transfer Function
        4. 6.3.1.4 DAC Gain and Offset Calibration
        5. 6.3.1.5 Programmable Slew Rate
        6. 6.3.1.6 DAC Register Structure and CLEAR State
      2. 6.3.2  Analog-to-Digital Converter (ADC) Overview
        1. 6.3.2.1 ADC Operation
        2. 6.3.2.2 ADC Custom Channel Sequencer
        3. 6.3.2.3 ADC Synchronization
        4. 6.3.2.4 ADC Offset Calibration
        5. 6.3.2.5 External Monitoring Inputs
        6. 6.3.2.6 Temperature Sensor
        7. 6.3.2.7 Self-Diagnostic Multiplexer
        8. 6.3.2.8 ADC Bypass
      3. 6.3.3  Programmable Out-of-Range Alarms
        1. 6.3.3.1 Alarm-Based Interrupts
        2. 6.3.3.2 Alarm Action Configuration Register
        3. 6.3.3.3 Alarm Voltage Generator
        4. 6.3.3.4 Temperature Sensor Alarm Function
        5. 6.3.3.5 Internal Reference Alarm Function
        6. 6.3.3.6 ADC Alarm Function
        7. 6.3.3.7 Fault Detection
      4. 6.3.4  IRQ
      5. 6.3.5  Internal Reference
      6. 6.3.6  Integrated Precision Oscillator
      7. 6.3.7  Precision Oscillator Diagnostics
      8. 6.3.8  One-Time Programmable (OTP) Memory
      9. 6.3.9  GPIO
      10. 6.3.10 Timer
      11. 6.3.11 Unique Chip Identifier (ID)
      12. 6.3.12 Scratch Pad Register
    4. 6.4 Device Functional Modes
      1. 6.4.1 Register Built-In Self-Test (RBIST)
      2. 6.4.2 DAC Power-Down Mode
      3. 6.4.3 Reset
    5. 6.5 Programming
      1. 6.5.1 Communication Setup
        1. 6.5.1.1 SPI Mode
        2. 6.5.1.2 UART Mode
      2. 6.5.2 GPIO Programming
      3. 6.5.3 Serial Peripheral Interface (SPI)
        1. 6.5.3.1 SPI Frame Definition
        2. 6.5.3.2 SPI Read and Write
        3. 6.5.3.3 Frame Error Checking
        4. 6.5.3.4 Synchronization
      4. 6.5.4 UART Interface
        1. 6.5.4.1 UART Break Mode (UBM)
      5. 6.5.5 Status Bits
      6. 6.5.6 Watchdog Timer
  8. 7 Register Maps
    1. 7.1 AFEx8201 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multichannel Configuration
    2. 8.2 Typical Application
      1. 8.2.1 Analog Output Module
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 XTR305
            1. 8.2.1.2.1.1 Current-Output Mode
            2. 8.2.1.2.1.2 Voltage Output Mode
            3. 8.2.1.2.1.3 Diagnostic Features
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RRU|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage PVDD, IOVDD to GND –0.3 5.5 V
VDD to GND –0.3 1.98 V
AIN0, POL_SEL/AIN1, VOUT to GND –0.3 PVDD + 0.3 V
Digital Input/Output to GND –0.3 IOVDD + 0.3 V
VREFIO to GND –0.3 VDD + 0.3 V
REF_GND to GND –0.3 0.3 V
Input current into any pin –10 10 mA
TJ Junction temperature –55 150 °C
Tstg Storage temperature –65 150
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.