SLASF44A May   2023  – June 2024 AFE78201 , AFE88201

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements
    7. 5.7  Timing Diagrams
    8. 5.8  Typical Characteristics: VOUT DAC
    9. 5.9  Typical Characteristics: ADC
    10. 5.10 Typical Characteristics: Reference
    11. 5.11 Typical Characteristics: Power Supply
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Digital-to-Analog Converter (DAC) Overview
        1. 6.3.1.1 DAC Resistor String
        2. 6.3.1.2 DAC Buffer Amplifier
        3. 6.3.1.3 DAC Transfer Function
        4. 6.3.1.4 DAC Gain and Offset Calibration
        5. 6.3.1.5 Programmable Slew Rate
        6. 6.3.1.6 DAC Register Structure and CLEAR State
      2. 6.3.2  Analog-to-Digital Converter (ADC) Overview
        1. 6.3.2.1 ADC Operation
        2. 6.3.2.2 ADC Custom Channel Sequencer
        3. 6.3.2.3 ADC Synchronization
        4. 6.3.2.4 ADC Offset Calibration
        5. 6.3.2.5 External Monitoring Inputs
        6. 6.3.2.6 Temperature Sensor
        7. 6.3.2.7 Self-Diagnostic Multiplexer
        8. 6.3.2.8 ADC Bypass
      3. 6.3.3  Programmable Out-of-Range Alarms
        1. 6.3.3.1 Alarm-Based Interrupts
        2. 6.3.3.2 Alarm Action Configuration Register
        3. 6.3.3.3 Alarm Voltage Generator
        4. 6.3.3.4 Temperature Sensor Alarm Function
        5. 6.3.3.5 Internal Reference Alarm Function
        6. 6.3.3.6 ADC Alarm Function
        7. 6.3.3.7 Fault Detection
      4. 6.3.4  IRQ
      5. 6.3.5  Internal Reference
      6. 6.3.6  Integrated Precision Oscillator
      7. 6.3.7  Precision Oscillator Diagnostics
      8. 6.3.8  One-Time Programmable (OTP) Memory
      9. 6.3.9  GPIO
      10. 6.3.10 Timer
      11. 6.3.11 Unique Chip Identifier (ID)
      12. 6.3.12 Scratch Pad Register
    4. 6.4 Device Functional Modes
      1. 6.4.1 Register Built-In Self-Test (RBIST)
      2. 6.4.2 DAC Power-Down Mode
      3. 6.4.3 Reset
    5. 6.5 Programming
      1. 6.5.1 Communication Setup
        1. 6.5.1.1 SPI Mode
        2. 6.5.1.2 UART Mode
      2. 6.5.2 GPIO Programming
      3. 6.5.3 Serial Peripheral Interface (SPI)
        1. 6.5.3.1 SPI Frame Definition
        2. 6.5.3.2 SPI Read and Write
        3. 6.5.3.3 Frame Error Checking
        4. 6.5.3.4 Synchronization
      4. 6.5.4 UART Interface
        1. 6.5.4.1 UART Break Mode (UBM)
      5. 6.5.5 Status Bits
      6. 6.5.6 Watchdog Timer
  8. 7 Register Maps
    1. 7.1 AFEx8201 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multichannel Configuration
    2. 8.2 Typical Application
      1. 8.2.1 Analog Output Module
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 XTR305
            1. 8.2.1.2.1.1 Current-Output Mode
            2. 8.2.1.2.1.2 Voltage Output Mode
            3. 8.2.1.2.1.3 Diagnostic Features
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RRU|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC1 AFEx8201
 UNIT
RRU (UQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 103.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 84.4 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJB Junction-to-board thermal resistance 69.5 °C/W
ΨJT Junction-to-top characterization parameter 0.4 °C/W
ΨJB Junction-to-board characterization parameter 68.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.