SPRSPA7A September   2024  – November 2024 AM2612

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
    1. 3.1 Functional Block Diagram
  5. Package Comparison
    1. 4.1 Related Products
  6. Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM261x ZCZ Pin Diagram
      2. 5.1.2 AM261x ZFG Pin Diagram
      3. 5.1.3 AM261x ZEJ Pin Diagram
      4. 5.1.4 AM261x ZNC Pin Diagram
    2. 5.2 Pin Attributes
      1.      15
      2.      16
    3. 5.3 Signal Descriptions
      1.      18
      2. 5.3.1  ADC
        1.       20
        2.       21
        3.       22
      3. 5.3.2  ADC_CAL
        1.       24
      4. 5.3.3  ADC VREF
        1.       26
      5. 5.3.4  CPSW
        1.       28
        2.       29
        3.       30
        4.       31
        5.       32
        6.       33
        7.       34
      6. 5.3.5  CPTS
        1.       36
      7. 5.3.6  DAC
        1.       38
      8. 5.3.7  EPWM
        1.       40
        2.       41
        3.       42
        4.       43
        5.       44
        6.       45
        7.       46
        8.       47
        9.       48
        10.       49
      9. 5.3.8  EQEP
        1.       51
        2.       52
      10. 5.3.9  FSI
        1.       54
        2.       55
      11. 5.3.10 GPIO
        1.       57
      12. 5.3.11 GPMC0
        1.       59
      13. 5.3.12 I2C
        1.       61
        2.       62
        3.       63
      14. 5.3.13 LIN
        1.       65
        2.       66
        3.       67
      15. 5.3.14 MCAN
        1.       69
        2.       70
      16. 5.3.15 SPI (MCSPI)
        1.       72
        2.       73
        3.       74
        4.       75
      17. 5.3.16 MMC
        1.       77
      18. 5.3.17 Power Supply
        1.       79
      19. 5.3.18 PRU-ICSS
        1.       81
        2.       82
        3.       83
        4.       84
        5.       85
      20. 5.3.19 OSPI
        1.       87
        2.       88
      21. 5.3.20 SDFM
        1.       90
        2.       91
      22. 5.3.21 System and Miscellaneous
        1. 5.3.21.1 Boot Mode Configuration
          1.        94
        2. 5.3.21.2 Clocking
          1.        96
          2.        97
          3.        98
        3. 5.3.21.3 Emulation and Debug
          1.        100
          2.        101
        4. 5.3.21.4 SYSTEM
          1.        103
        5. 5.3.21.5 USB0
          1.        105
        6. 5.3.21.6 VMON
          1.        107
        7.       108
          1.        109
      23. 5.3.22 UART
        1.       111
        2.       112
        3.       113
        4.       114
        5.       115
        6.       116
      24. 5.3.23 XBAR
        1.       118
        2.       119
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Electrical Characteristics
      1. 6.3.1 Digital and Analog IO Electrical Characteristics
    4. 6.4 Thermal Resistance Characteristics
      1. 6.4.1 Package Thermal Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-R5F Subsystem
  9. Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 External Oscillator
      2. 8.1.2 JTAG, EMU, and TRACE
      3. 8.1.3 Hardware Reference Design and Guidelines
  10. Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • ZFG|304
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Table 5-45 Power Supply Signal Descriptions
Signal Name [1]Pin Type [2]Description [3]ZCZ PIN [4]ZFG PIN [4]ZEJ PIN [4]ZNC PIN [4]
VDDPower1.2V Core supplyE11, E9, F11, F9, G13, G14, G5, G6, K13, K14, K5, K6, N13, N14, N5, N6F12, F14, F7, F9, G15, G6, J15, J6, M15, M6, P15, P6, R7E11, E5, E7, E9, F12, G5, H12, J5, K12, L5, M12, M6E10, E12, E14, E6, E8, F15, F5, H15, H5, K15, K5, M15, M5, P15, P5, R15, R6, T6
VDDA18_LDOPower1.8V Analog LDO OutputR11, R6, R8U10, U11N9U9
VDDA18_OSC_PLLPower1.8V PLL supplyR4U8N6U7
VDDA18_USBPowerUSB 1.8V analog supplyT5N4U3
VDDA33Power3.3V analog supplyP11, P7, P9T12, T9M10, M8T10, T12
VDDA33_USBPowerUSB 3.3V analog supplyP5M4R3
VDDAR2PowerSRAM Array supplyD10D13D10C11
VDDAR3PowerSRAM Array supplyH3H4G4G3
VDDS18Power1.8V IO supplyD6, E15, L4, N15E14, E9, F4, G16, L17, N4, T16D12, D6, D9, E4, G13, K13, K4, N13D10, D14, D6, H16, H4, L3, M16, T16
VDDS18_LDOPower1.8V Digital LDO OutputT3U6P4V4
VDDS1833_FLASH0Power1.8V/3.3V Flash 0 IO SupplyJ5H4, J4K4, M4
VDDS1833_FLASH1Power1.8V/3.3V Flash 1 IO SupplyP16M13P16
VDDS1833_FLASH0-SIPPower1.8V/3.3V SIP Flash Supply. This must be shorted to VDDSHV_D(VDDS1833_FLASH0) on board. Will be used for Flash supply in future Flash SIP packages.F1, J1
VDDS33Power3.3V IO supplyD12, H15, H4, L15, P4, R15E12, E16, E7, G5, J16, M16, M5, T14, T7D11, D4, D7, F13, J13, L4, N12, N5C15, D12, D8, F16, F4, K16, P4, T14, U5
VDD_TEMPPowerVDD TempT4V7N8T8
VNWAPower1.2V N-well biasJ16K17H13J17
VSSA-Analog GroundP10, P12, P6, P8, R13, R5, V1, V16R12, R9M11, M9R10, R12