SPRSPA7A September   2024  – November 2024 AM2612

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Package Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM261x ZCZ Pin Diagram
      2. 5.1.2 AM261x ZFG Pin Diagram
      3. 5.1.3 AM261x ZEJ Pin Diagram
      4. 5.1.4 AM261x ZNC Pin Diagram
    2. 5.2 Pin Attributes
      1.      15
      2.      16
    3. 5.3 Signal Descriptions
      1.      18
      2. 5.3.1  ADC
        1.       20
        2.       21
        3.       22
      3. 5.3.2  ADC_CAL
        1.       24
      4. 5.3.3  ADC VREF
        1.       26
      5. 5.3.4  CPSW
        1.       28
        2.       29
        3.       30
        4.       31
        5.       32
        6.       33
        7.       34
      6. 5.3.5  CPTS
        1.       36
      7. 5.3.6  DAC
        1.       38
      8. 5.3.7  EPWM
        1.       40
        2.       41
        3.       42
        4.       43
        5.       44
        6.       45
        7.       46
        8.       47
        9.       48
        10.       49
      9. 5.3.8  EQEP
        1.       51
        2.       52
      10. 5.3.9  FSI
        1.       54
        2.       55
      11. 5.3.10 GPIO
        1.       57
      12. 5.3.11 GPMC0
        1.       59
      13. 5.3.12 I2C
        1.       61
        2.       62
        3.       63
      14. 5.3.13 LIN
        1.       65
        2.       66
        3.       67
      15. 5.3.14 MCAN
        1.       69
        2.       70
      16. 5.3.15 SPI (MCSPI)
        1.       72
        2.       73
        3.       74
        4.       75
      17. 5.3.16 MMC
        1.       77
      18. 5.3.17 Power Supply
        1.       79
      19. 5.3.18 PRU-ICSS
        1.       81
        2.       82
        3.       83
        4.       84
        5.       85
      20. 5.3.19 OSPI
        1.       87
        2.       88
      21. 5.3.20 SDFM
        1.       90
        2.       91
      22. 5.3.21 System and Miscellaneous
        1. 5.3.21.1 Boot Mode Configuration
          1.        94
        2. 5.3.21.2 Clocking
          1.        96
          2.        97
          3.        98
        3. 5.3.21.3 Emulation and Debug
          1.        100
          2.        101
        4. 5.3.21.4 SYSTEM
          1.        103
        5. 5.3.21.5 USB0
          1.        105
        6. 5.3.21.6 VMON
          1.        107
        7.       108
          1.        109
      23. 5.3.22 UART
        1.       111
        2.       112
        3.       113
        4.       114
        5.       115
        6.       116
      24. 5.3.23 XBAR
        1.       118
        2.       119
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Electrical Characteristics
      1. 6.3.1 Digital and Analog IO Electrical Characteristics
    4. 6.4 Thermal Resistance Characteristics
      1. 6.4.1 Package Thermal Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-R5F Subsystem
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 External Oscillator
      2. 8.1.2 JTAG, EMU, and TRACE
      3. 8.1.3 Hardware Reference Design and Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • ZFG|304
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.6 Electrostatic Discharge Caution

AM2612 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.